EP4CGX110CF23C8N vs EP4CGX110DF23I7N Vergleich
Detaillierter Direktvergleich von EP4CGX110CF23C8N von Intel und EP4CGX110DF23I7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CGX110CF23C8N | EP4CGX110DF23I7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $170,45 | $182,00 |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 109,424 | 109,424 |
| Logic Array Blocks (LABs) | 6,839 | 6,839 |
| Embedded Memory (bits) | 5,621,760 | — |
| User I/O Count | 270 | — |
| Transceivers | 4 channels | Up to 3.125 Gbps embedded transceivers |
| Transceiver Data Rate (max) | 3.125 Gbps | — |
| DSP Blocks (18x18 multipliers) | [DATA_NEEDED: DSP block count] | — |
| Process Node | 60 nm | — |
| Core Voltage | 1.2 V | — |
| Speed Grade | C8 | 7 |
| Betriebstemperatur | 0 C to 85 C (commercial) | -40C to +100C (industrial) |
| Gehäuse | 484-ball FBGA (F23) | 484-ball FBGA, 23 x 23 mm, 1.00 mm pitch |
| Montageart | Surface Mount (BGA) | Surface Mount |
| RoHS-Status | Compliant | Compliant |
| Lead-Free | Yes | — |
| MSL-Level | 3 | — |
| Configuration Method | Quartus Prime / JTAG / Active Serial | — |
| User I/O Pins | — | 270 |
| Embedded Memory | — | 4.4 Mbits (approximate) |
| Embedded 18x18 Multipliers | — | 56 |
| Core Supply Voltage (VCCINT) | — | 1.15 V to 1.25 V (nominal 1.2 V) |
| Process Technology | — | 60 nm low-power CMOS |
| Package Code | — | BGA (FBGA) |
| Configuration Memory | — | SRAM-based (volatile, requires external config device) |