EP4CGX110CF23C8N vs EP4CGX75CF23C8 Comparison

Detailed side-by-side comparison of EP4CGX110CF23C8N by Intel and EP4CGX75CF23C8 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP4CGX110CF23C8N EP4CGX75CF23C8
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Family Cyclone IV GX Cyclone IV GX
Logic Elements 109,424 —
Logic Array Blocks (LABs) 6,839 —
Embedded Memory (bits) 5,621,760 —
User I/O Count 270 —
Transceivers 4 channels 8 channels, up to 3.125 Gbps
Transceiver Data Rate (max) 3.125 Gbps —
DSP Blocks (18x18 multipliers) [DATA_NEEDED: DSP block count] —
Process Node 60 nm —
Core Voltage 1.2 V 1.2 V (typical)
Speed Grade C8 8 (commercial)
Operating Temperature 0 C to 85 C (commercial) 0C to +85C (commercial)
Package 484-ball FBGA (F23) 484-ball FBGA (F23)
Mounting Type Surface Mount (BGA) Surface Mount (BGA)
RoHS Status Compliant Compliant
Lead-Free Yes —
MSL Level 3 —
Configuration Method Quartus Prime / JTAG / Active Serial —
Logic Elements (LE) — 73,920
Configurable Logic Blocks (CLBs) — 4,620
Embedded Memory — 4,257,792 bits (~4.05 Mbit)
Maximum User I/O — 290
PCIe Hard IP Blocks — 2 (Gen1)
Package Body Size — 23 x 23 mm
Ball Pitch — 1.0 mm
Process Technology — 60 nm low-power

Datasheets & Resources

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