EP4CGX110CF23C8N vs EP4CGX75CF23C8 Comparación
Comparación detallada lado a lado de EP4CGX110CF23C8N por Intel y EP4CGX75CF23C8 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4CGX110CF23C8N | EP4CGX75CF23C8 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $170,45 | $88,20 |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 109,424 | — |
| Logic Array Blocks (LABs) | 6,839 | — |
| Embedded Memory (bits) | 5,621,760 | — |
| User I/O Count | 270 | — |
| Transceivers | 4 channels | 8 channels, up to 3.125 Gbps |
| Transceiver Data Rate (max) | 3.125 Gbps | — |
| DSP Blocks (18x18 multipliers) | [DATA_NEEDED: DSP block count] | — |
| Process Node | 60 nm | — |
| Core Voltage | 1.2 V | 1.2 V (typical) |
| Speed Grade | C8 | 8 (commercial) |
| Temperatura de funcionamiento | 0 C to 85 C (commercial) | 0C to +85C (commercial) |
| Encapsulado | 484-ball FBGA (F23) | 484-ball FBGA (F23) |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount (BGA) |
| Estado RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Nivel MSL | 3 | — |
| Configuration Method | Quartus Prime / JTAG / Active Serial | — |
| Logic Elements (LE) | — | 73,920 |
| Configurable Logic Blocks (CLBs) | — | 4,620 |
| Embedded Memory | — | 4,257,792 bits (~4.05 Mbit) |
| Maximum User I/O | — | 290 |
| PCIe Hard IP Blocks | — | 2 (Gen1) |
| Package Body Size | — | 23 x 23 mm |
| Ball Pitch | — | 1.0 mm |
| Process Technology | — | 60 nm low-power |