EP4CGX110CF23C8N vs EP4CGX75CF23C8 Vergleich
Detaillierter Direktvergleich von EP4CGX110CF23C8N von Intel und EP4CGX75CF23C8 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CGX110CF23C8N | EP4CGX75CF23C8 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $170,45 | $88,20 |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 109,424 | — |
| Logic Array Blocks (LABs) | 6,839 | — |
| Embedded Memory (bits) | 5,621,760 | — |
| User I/O Count | 270 | — |
| Transceivers | 4 channels | 8 channels, up to 3.125 Gbps |
| Transceiver Data Rate (max) | 3.125 Gbps | — |
| DSP Blocks (18x18 multipliers) | [DATA_NEEDED: DSP block count] | — |
| Process Node | 60 nm | — |
| Core Voltage | 1.2 V | 1.2 V (typical) |
| Speed Grade | C8 | 8 (commercial) |
| Betriebstemperatur | 0 C to 85 C (commercial) | 0C to +85C (commercial) |
| Gehäuse | 484-ball FBGA (F23) | 484-ball FBGA (F23) |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| RoHS-Status | Compliant | Compliant |
| Lead-Free | Yes | — |
| MSL-Level | 3 | — |
| Configuration Method | Quartus Prime / JTAG / Active Serial | — |
| Logic Elements (LE) | — | 73,920 |
| Configurable Logic Blocks (CLBs) | — | 4,620 |
| Embedded Memory | — | 4,257,792 bits (~4.05 Mbit) |
| Maximum User I/O | — | 290 |
| PCIe Hard IP Blocks | — | 2 (Gen1) |
| Package Body Size | — | 23 x 23 mm |
| Ball Pitch | — | 1.0 mm |
| Process Technology | — | 60 nm low-power |