EP4CGX110DF31C8N vs EP4CGX110DF31I7 Comparison

Detailed side-by-side comparison of EP4CGX110DF31C8N by Intel and EP4CGX110DF31I7 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP4CGX110DF31C8N EP4CGX110DF31I7
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $325.00 $276.34
Family Cyclone IV GX β€”
Logic Elements 109,424 β€”
Logic Array Blocks (LABs) 6,839 β€”
Embedded Memory Bits 5,621,760 (approximately 702 Kbits) β€”
Embedded Memory Blocks M9K blocks, 9-bit parity β€”
DSP Blocks (18x18 Multipliers) 264 multipliers β€”
Maximum User I/Os 475 β€”
I/O Banks 8 β€”
PLLs 4 general-purpose PLLs 4
Transceivers 8 high-speed transceivers up to 3.125 Gbps 8 (up to 3.125 Gbps)
PCI Express Hard IP PCIe Gen1/Gen2 x1/x2/x4 β€”
Core Supply Voltage 1.2 V β€”
Process Technology 60 nm low-power CMOS β€”
Package 896-ball FineLine BGA (F31), 31 mm 896-BGA (FBGA-896), 31 mm
Operating Temperature (Commercial) 0C to 85C β€”
Speed Grade 8 -7
Configuration SRAM-based, supports AS, PS, JTAG, FPP β€”
RoHS Status Compliant Compliant
Series β€” Cyclone IV GX
Device Logic Elements β€” 109,424
Total Memory Bits β€” 5,621,760
Number of Logic Array Blocks (LABs) β€” Not specified in provided data [DATA_NEEDED: LAB count]
Number of I/O β€” 475 user I/O
Multipliers (18x18) β€” 432
M9K Memory Blocks β€” 270
Ball Pitch β€” 0.8 mm
Temperature Grade β€” Industrial (-40C to +100C Tj)
Core Voltage β€” 1.2 V typical
Configuration Method β€” SRAM (EPCS or JTAG)
Mounting Type β€” Surface Mount
MSL Level β€” 3 (per JEDEC J-STD-020) [DATA_NEEDED: floor life days]

Datasheets & Resources

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