EP4CGX110DF31C8N vs EP4CGX110DF31I7 Perbandingan

Perbandingan bersamaan detil EP4CGX110DF31C8N dari Intel dan EP4CGX110DF31I7 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum EP4CGX110DF31C8N EP4CGX110DF31I7
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Aktif
Family Cyclone IV GX —
Logic Elements 109,424 —
Logic Array Blocks (LABs) 6,839 —
Embedded Memory Bits 5,621,760 (approximately 702 Kbits) —
Embedded Memory Blocks M9K blocks, 9-bit parity —
DSP Blocks (18x18 Multipliers) 264 multipliers —
Maximum User I/Os 475 —
I/O Banks 8 —
PLLs 4 general-purpose PLLs 4
Transceivers 8 high-speed transceivers up to 3.125 Gbps 8 (up to 3.125 Gbps)
PCI Express Hard IP PCIe Gen1/Gen2 x1/x2/x4 —
Core Supply Voltage 1.2 V —
Process Technology 60 nm low-power CMOS —
Paket 896-ball FineLine BGA (F31), 31 mm 896-BGA (FBGA-896), 31 mm
Operating Temperature (Commercial) 0C to 85C —
Speed Grade 8 -7
Configuration SRAM-based, supports AS, PS, JTAG, FPP —
Status RoHS Compliant Compliant
Series — Cyclone IV GX
Device Logic Elements — 109,424
Total Memory Bits — 5,621,760
Number of Logic Array Blocks (LABs) — Not specified in provided data [DATA_NEEDED: LAB count]
Number of I/O — 475 user I/O
Multipliers (18x18) — 432
M9K Memory Blocks — 270
Ball Pitch — 0.8 mm
Temperature Grade — Industrial (-40C to +100C Tj)
Core Voltage — 1.2 V typical
Configuration Method — SRAM (EPCS or JTAG)
Tipe Mounting — Surface Mount
Level MSL — 3 (per JEDEC J-STD-020) [DATA_NEEDED: floor life days]

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