EP4CGX110DF31C8N vs EP4CGX110DF31I7 比較

詳細並排比較 EP4CGX110DF31C8N 由 Intel 與 EP4CGX110DF31I7 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP4CGX110DF31C8N EP4CGX110DF31I7
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 啟用中
Family Cyclone IV GX —
Logic Elements 109,424 —
Logic Array Blocks (LABs) 6,839 —
Embedded Memory Bits 5,621,760 (approximately 702 Kbits) —
Embedded Memory Blocks M9K blocks, 9-bit parity —
DSP Blocks (18x18 Multipliers) 264 multipliers —
Maximum User I/Os 475 —
I/O Banks 8 —
PLLs 4 general-purpose PLLs 4
Transceivers 8 high-speed transceivers up to 3.125 Gbps 8 (up to 3.125 Gbps)
PCI Express Hard IP PCIe Gen1/Gen2 x1/x2/x4 —
Core Supply Voltage 1.2 V —
Process Technology 60 nm low-power CMOS —
封裝 896-ball FineLine BGA (F31), 31 mm 896-BGA (FBGA-896), 31 mm
Operating Temperature (Commercial) 0C to 85C —
Speed Grade 8 -7
Configuration SRAM-based, supports AS, PS, JTAG, FPP —
RoHS 狀態 Compliant Compliant
Series — Cyclone IV GX
Device Logic Elements — 109,424
Total Memory Bits — 5,621,760
Number of Logic Array Blocks (LABs) — Not specified in provided data [DATA_NEEDED: LAB count]
Number of I/O — 475 user I/O
Multipliers (18x18) — 432
M9K Memory Blocks — 270
Ball Pitch — 0.8 mm
Temperature Grade — Industrial (-40C to +100C Tj)
Core Voltage — 1.2 V typical
Configuration Method — SRAM (EPCS or JTAG)
安裝類型 — Surface Mount
MSL 等級 — 3 (per JEDEC J-STD-020) [DATA_NEEDED: floor life days]

資料表與資源

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