EP4CGX50CF23C7N vs EP4CGX50DF23C7N Comparison

Detailed side-by-side comparison of EP4CGX50CF23C7N by Intel and EP4CGX50DF23C7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP4CGX50CF23C7N EP4CGX50DF23C7N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $110.50 $43.20
Family Cyclone IV GX Cyclone IV GX
Logic Elements (LE) 49,888 β€”
Embedded Memory (Bits) 2,562,048 (2.5 Mb) β€”
User I/O 290 β€”
Logic Array Blocks 47 β€”
Multi-Gigabit Transceivers 4 channels up to 3.125 Gbps β€”
Hard Memory Controllers Yes (DDR/DDR2/QDRII/QDRII+/RLDRAM II) β€”
Core Voltage 1.2 V β€”
I/O Voltage Standards LVTTL, LVCMOS, LVDS, SSTL, HSTL (1.2V-3.3V) β€”
Package 484-FBGA (F23, 23 x 23 mm) 484-ball FBGA (Plastic BGA, S-PBGA-B484, 23x23 mm)
Speed Grade C7 (commercial) β€”
Operating Temperature -40C to +85C (commercial) 0 Β°C to 85 Β°C (commercial)
Process Technology 60 nm TSMC low-power 60 nm
Configuration Modes JTAG, Active Serial (EPCS), Passive Serial, Fast Passive Parallel Passive Serial (PS), Active Serial (AS), JTAG
RoHS Status Compliant (lead-free) Compliant (Pb-free variant)
Mounting Type Surface Mount Surface Mount
Logic Elements β€” 49,888
Configurable Logic Blocks (CLBs) β€” 3,118
Total RAM Bits β€” 2,432 Kbit (β‰ˆ 304 KB)
Embedded 18x18 Multipliers β€” 66
PLLs β€” 2
Global Clock Networks β€” 8 (with up to 16 clock pins per region)
Number of I/O Pins β€” 290
Transceivers β€” Up to 8 channels, 3.125 Gbps
Core Supply Voltage (VCCINT) β€” 1.15 V to 1.25 V (nominal 1.2 V)
Supported Memory Interfaces β€” DDR2 SDRAM, QDRII SRAM, RLDRAM II
MSL Level β€” 3 (168 hours)

Datasheets & Resources

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