EP4CGX50DF23C6N vs EP4CGX50DF23C8N Comparison
Detailed side-by-side comparison of EP4CGX50DF23C6N by Intel and EP4CGX50DF23C8N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP4CGX50DF23C6N | EP4CGX50DF23C8N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 49,888 | 49,888 |
| Configurable Logic Blocks (CLBs) | 3,118 | 3,118 |
| Embedded Memory | 2,340 Kbits | — |
| Process Technology | 60 nm | 60 nm |
| Core Voltage | 1.2 V | — |
| Number of Pins / Balls | 484 | — |
| Package Type | 484-ball FBGA (PBGA) | — |
| JEDEC Package Code | S-PBGA-B484 | — |
| User I/O | 218 | — |
| Transceiver Channels | Up to 8 | — |
| Maximum Transceiver Data Rate | 3.125 Gbps | — |
| Operating Temperature Grade | Commercial | Commercial (0C to +85C) |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| Configuration Method | JTAG / Passive Serial / Active Serial | — |
| Core Supply Voltage | — | 1.2 V |
| Transceivers | — | Up to 8 channels, 3.125 Gbps |
| Package | — | 484-ball FBGA (DF23) |
| Ball Pitch | — | 1.00 mm |
| Seated Height | — | 2.40 mm |
| Terminal Form | — | Ball |
| Configuration Modes | — | JTAG, Passive Serial, Active Serial |
| MSL Level | — | 3 (168 hours) |
| RoHS Status | — | Compliant |