EP4CGX50DF23C6N vs EP4CGX50DF23C8N 比較
詳細並排比較 EP4CGX50DF23C6N 由 Intel 與 EP4CGX50DF23C8N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP4CGX50DF23C6N | EP4CGX50DF23C8N |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 49,888 | 49,888 |
| Configurable Logic Blocks (CLBs) | 3,118 | 3,118 |
| Embedded Memory | 2,340 Kbits | — |
| Process Technology | 60 nm | 60 nm |
| Core Voltage | 1.2 V | — |
| Number of Pins / Balls | 484 | — |
| Package Type | 484-ball FBGA (PBGA) | — |
| JEDEC Package Code | S-PBGA-B484 | — |
| User I/O | 218 | — |
| Transceiver Channels | Up to 8 | — |
| Maximum Transceiver Data Rate | 3.125 Gbps | — |
| Operating Temperature Grade | Commercial | Commercial (0C to +85C) |
| 安裝類型 | Surface Mount (BGA) | Surface Mount |
| Configuration Method | JTAG / Passive Serial / Active Serial | — |
| Core Supply Voltage | — | 1.2 V |
| Transceivers | — | Up to 8 channels, 3.125 Gbps |
| 封裝 | — | 484-ball FBGA (DF23) |
| Ball Pitch | — | 1.00 mm |
| Seated Height | — | 2.40 mm |
| Terminal Form | — | Ball |
| Configuration Modes | — | JTAG, Passive Serial, Active Serial |
| MSL 等級 | — | 3 (168 hours) |
| RoHS 狀態 | — | Compliant |