EP4CGX50DF23C6N vs EP4CGX50DF23C8N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP4CGX50DF23C6N disebabkan oleh Intel dan EP4CGX50DF23C8N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP4CGX50DF23C6N | EP4CGX50DF23C8N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 49,888 | 49,888 |
| Configurable Logic Blocks (CLBs) | 3,118 | 3,118 |
| Embedded Memory | 2,340 Kbits | — |
| Process Technology | 60 nm | 60 nm |
| Core Voltage | 1.2 V | — |
| Number of Pins / Balls | 484 | — |
| Package Type | 484-ball FBGA (PBGA) | — |
| JEDEC Package Code | S-PBGA-B484 | — |
| User I/O | 218 | — |
| Transceiver Channels | Up to 8 | — |
| Maximum Transceiver Data Rate | 3.125 Gbps | — |
| Operating Temperature Grade | Commercial | Commercial (0C to +85C) |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Configuration Method | JTAG / Passive Serial / Active Serial | — |
| Core Supply Voltage | — | 1.2 V |
| Transceivers | — | Up to 8 channels, 3.125 Gbps |
| Kemasan | — | 484-ball FBGA (DF23) |
| Ball Pitch | — | 1.00 mm |
| Seated Height | — | 2.40 mm |
| Terminal Form | — | Ball |
| Configuration Modes | — | JTAG, Passive Serial, Active Serial |
| Aras MSL | — | 3 (168 hours) |
| Status RoHS | — | Compliant |