EP4CGX50DF23C6N vs EP4CGX50DF23C8N Perbandingan
Perbandingan bersamaan detil EP4CGX50DF23C6N dari Intel dan EP4CGX50DF23C8N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP4CGX50DF23C6N | EP4CGX50DF23C8N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 49,888 | 49,888 |
| Configurable Logic Blocks (CLBs) | 3,118 | 3,118 |
| Embedded Memory | 2,340 Kbits | — |
| Process Technology | 60 nm | 60 nm |
| Core Voltage | 1.2 V | — |
| Number of Pins / Balls | 484 | — |
| Package Type | 484-ball FBGA (PBGA) | — |
| JEDEC Package Code | S-PBGA-B484 | — |
| User I/O | 218 | — |
| Transceiver Channels | Up to 8 | — |
| Maximum Transceiver Data Rate | 3.125 Gbps | — |
| Operating Temperature Grade | Commercial | Commercial (0C to +85C) |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Configuration Method | JTAG / Passive Serial / Active Serial | — |
| Core Supply Voltage | — | 1.2 V |
| Transceivers | — | Up to 8 channels, 3.125 Gbps |
| Paket | — | 484-ball FBGA (DF23) |
| Ball Pitch | — | 1.00 mm |
| Seated Height | — | 2.40 mm |
| Terminal Form | — | Ball |
| Configuration Modes | — | JTAG, Passive Serial, Active Serial |
| Level MSL | — | 3 (168 hours) |
| Status RoHS | — | Compliant |