EP4CGX75CF23C8 vs EP4CGX110CF23C8N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4CGX75CF23C8 sa pamamagitan ng Intel at EP4CGX110CF23C8N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP4CGX75CF23C8 | EP4CGX110CF23C8N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements (LE) | 73,920 | — |
| Configurable Logic Blocks (CLBs) | 4,620 | — |
| Embedded Memory | 4,257,792 bits (~4.05 Mbit) | — |
| Maximum User I/O | 290 | — |
| Transceivers | 8 channels, up to 3.125 Gbps | 4 channels |
| PCIe Hard IP Blocks | 2 (Gen1) | — |
| Packhaging | 484-ball FBGA (F23) | 484-ball FBGA (F23) |
| Package Body Size | 23 x 23 mm | — |
| Ball Pitch | 1.0 mm | — |
| Process Technology | 60 nm low-power | — |
| Core Voltage | 1.2 V (typical) | 1.2 V |
| Speed Grade | 8 (commercial) | C8 |
| Temperature na Operasyon | 0C to +85C (commercial) | 0 C to 85 C (commercial) |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Tindminan RoHS | Compliant | Compliant |
| Logic Elements | — | 109,424 |
| Logic Array Blocks (LABs) | — | 6,839 |
| Embedded Memory (bits) | — | 5,621,760 |
| User I/O Count | — | 270 |
| Transceiver Data Rate (max) | — | 3.125 Gbps |
| DSP Blocks (18x18 multipliers) | — | [DATA_NEEDED: DSP block count] |
| Process Node | — | 60 nm |
| Lead-Free | — | Yes |
| Level ng MSL | — | 3 |
| Configuration Method | — | Quartus Prime / JTAG / Active Serial |