EP4SGX530HH35I3N vs EP4SGX530KF43I3 Perbandingan
Perbandingan bersamaan detil EP4SGX530HH35I3N dari Intel dan EP4SGX530KF43I3 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP4SGX530HH35I3N | EP4SGX530KF43I3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Family | Stratix IV GX | Stratix IV GX |
| Device Type | FPGA - Field Programmable Gate Array | — |
| Logic Elements | 531,200 | — |
| Adaptive Logic Modules (ALMs) | 21,248 | 21,248 |
| Embedded Memory (bits) | 28,033,024 | — |
| Logic Blocks / LABs | 21,248 | 21,248 (per Mouser listing) |
| Maximum User I/Os | 564 | — |
| DSP Blocks | 1,024 (18x18 multipliers) | 1,120 |
| Transceivers | 24 channels | Up to 24 (600 Mbps to 8.5 Gbps per Stratix IV GX family) |
| Transceiver Data Rate (max) | 8.5 Gbps | — |
| PLLs | 8 (fractional support) | — |
| Suhu Kerja | -40C to +85C (industrial) | 0C to +85C (industrial) |
| Internal Frequency (max) | 800 MHz | — |
| Paket | 1152-ball FCBGA (HBGA), 42.5 x 42.5 mm, 1.0 mm pitch | 1760-ball FCBGA (KF43), 42.5 x 42.5 mm |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount (Flip-Chip BGA) |
| Status RoHS | Compliant | Compliant |
| Lead-Free | Yes | Yes |
| Level MSL | 3 | — |
| Process Node | 40 nm | — |
| Logic Elements (LE) | — | 531,200 |
| Embedded Memory Bits | — | 28,033,024 |
| User I/Os | — | 880 |
| Process Technology | — | 40 nm TSMC |
| Core Supply Voltage | — | 0.9 V |
| Internal Performance | — | Up to 800 MHz |
| Speed Grade | — | I3 (industrial, mid-speed) |
| PCIe Hard IP | — | PCI Express Gen1 / Gen2 |