EPF10K200EBC600-2 vs EPF10K200SBC600-2 Comparison

Detailed side-by-side comparison of EPF10K200EBC600-2 by Intel and EPF10K200SBC600-2 by Altera. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K200EBC600-2 EPF10K200SBC600-2
Brand Intel Altera
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $198.00 $85.00
Series FLEX-10KE FLEX-10KS
Logic Family CMOS (SRAM-based) CMOS (SRAM-based)
Process Technology 0.30 Β΅m CMOS 0.22 micrometer
Typical Gate Count 200,000 gates β€”
Logic Elements (LEs) 9984 β€”
Logic Array Blocks (LABs) 1248 1,248
Embedded Memory (EAB) 98304 bits (96 Kbits) β€”
Maximum User I/O 470 pins β€”
Propagation Delay 0.4 ns 0.4 ns
Supply Voltage 2.3 V to 2.7 V (core), 2.5/3.3 V (I/O) β€”
I/O Standards LVTTL, LVCMOS, PCI, GTL+ β€”
Package Type 600-ball BGA (BGA-600) β€”
Package Dimensions 45 Γ— 45 mm β€”
Ball Pitch 1.27 mm β€”
Package Height 1.1 mm max β€”
Operating Temperature 0Β°C to +70Β°C (Commercial) 0 C to 70 C
Mounting Type Surface Mount Surface Mount
Configuration Method JTAG (IEEE 1149.1), EPC2 serial PROM β€”
Part Status Obsolete β€”
RoHS Status unknown Non-compliant
Manufacturer β€” Altera (now Intel)
Logic Elements / Cells β€” 9,984
Typical Gates β€” 200,000
User I/Os β€” 470
Voltage - Supply (VCCINT) β€” 2.375 V to 2.625 V
Package / Case β€” 600-BGA (45 x 45 mm, 1.27 mm pitch)
Supplier Device Package β€” 600-BGA
Embedded Array Blocks (EABs) β€” Yes (for distributed RAM/ROM)
PLLs β€” 4
Configuration Interface β€” IEEE 1149.1 JTAG
MultiVolt I/O β€” Yes (1.5 V, 1.8 V, 2.5 V, 3.3 V, 5 V)
Packaging β€” Bulk / Tray

Datasheets & Resources

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