EPF10K200EBC600-2 vs EPF10K200SBC600-2 对比
详细并排对比 EPF10K200EBC600-2 出自 Intel 和 EPF10K200SBC600-2 出自 Altera。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EPF10K200EBC600-2 | EPF10K200SBC600-2 |
|---|---|---|
| 品牌 | Intel | Altera |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | Obsolete | Obsolete |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $198.00 | $85.00 |
| Series | FLEX-10KE | FLEX-10KS |
| Logic Family | CMOS (SRAM-based) | CMOS (SRAM-based) |
| Process Technology | 0.30 µm CMOS | 0.22 micrometer |
| Typical Gate Count | 200,000 gates | — |
| Logic Elements (LEs) | 9984 | — |
| Logic Array Blocks (LABs) | 1248 | 1,248 |
| Embedded Memory (EAB) | 98304 bits (96 Kbits) | — |
| Maximum User I/O | 470 pins | — |
| Propagation Delay | 0.4 ns | 0.4 ns |
| 电源电压 | 2.3 V to 2.7 V (core), 2.5/3.3 V (I/O) | — |
| I/O Standards | LVTTL, LVCMOS, PCI, GTL+ | — |
| Package Type | 600-ball BGA (BGA-600) | — |
| Package Dimensions | 45 × 45 mm | — |
| Ball Pitch | 1.27 mm | — |
| Package Height | 1.1 mm max | — |
| 工作温度 | 0°C to +70°C (Commercial) | 0 C to 70 C |
| 安装类型 | Surface Mount | Surface Mount |
| Configuration Method | JTAG (IEEE 1149.1), EPC2 serial PROM | — |
| Part Status | Obsolete | — |
| RoHS 状态 | unknown | Non-compliant |
| Manufacturer | — | Altera (now Intel) |
| Logic Elements / Cells | — | 9,984 |
| Typical Gates | — | 200,000 |
| User I/Os | — | 470 |
| Voltage - Supply (VCCINT) | — | 2.375 V to 2.625 V |
| 封装 / 外壳 | — | 600-BGA (45 x 45 mm, 1.27 mm pitch) |
| Supplier Device Package | — | 600-BGA |
| Embedded Array Blocks (EABs) | — | Yes (for distributed RAM/ROM) |
| PLLs | — | 4 |
| Configuration Interface | — | IEEE 1149.1 JTAG |
| MultiVolt I/O | — | Yes (1.5 V, 1.8 V, 2.5 V, 3.3 V, 5 V) |
| Packaging | — | Bulk / Tray |