EPF10K200EBI600-2N vs EPF10K250EBI600-3 Comparison
Detailed side-by-side comparison of EPF10K200EBI600-2N by Intel and EPF10K250EBI600-3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EPF10K250EBI600-3 - 250K Gates FLEX 10KE FPGA, 600-BGA | Intel
EPF10K250EBI600-3 β Last Time BuySpecification Comparison
| Parameter | EPF10K200EBI600-2N | EPF10K250EBI600-3 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Last_time_buy |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $140.00 | $110.00 |
| Family | FLEX 10KE | FLEX 10KE |
| Typical Gates | 200,000 | β |
| Maximum System Gates | 513,000 | β |
| Logic Elements (LEs) | 9,984 | β |
| Embedded Array Blocks (EABs) | 12 | β |
| Total RAM Bits | 98,304 | β |
| User I/O Pins | 470 | β |
| Dedicated Inputs | 6 | 4 |
| Package | 600-ball BGA (45 mm x 45 mm, 1.27 mm pitch) | 600-ball BGA (HBGA) |
| Technology / Process | 0.22 Β΅m CMOS SRAM | β |
| Core Supply Voltage | 2.5 V (2.3 V to 2.7 V) | β |
| I/O Supply Voltage | 2.5 V / 3.3 V (5 V tolerant I/O available) | β |
| Propagation Delay | 0.4 ns to 0.6 ns (per LE) | β |
| Maximum Internal Frequency | 200 MHz | β |
| Operating Temperature | 0 Β°C to +70 Β°C (commercial) | Industrial, 0C to +85C [DATA_NEEDED: confirm -40C to +85C range] |
| Configuration Method | SRAM, JTAG (IEEE 1149.1), serial configuration EPROM | SRAM, requires external configuration device (EPC series) |
| MSL Level | [DATA_NEEDED: moisture sensitivity level] | β |
| RoHS Status | [DATA_NEEDED: RoHS compliance status] | Not specified (SnPb / tin-lead finish per legacy distributor listing) |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| Logic Elements | β | 12,160 |
| Typical Gate Count | β | 250,000 system gates |
| Embedded System Blocks (ESBs) | β | 12 |
| Maximum User I/O | β | 470 |
| PLLs | β | 4 |
| On-chip RAM | β | Up to 40 Kbits |
| Ball Pitch | β | 1.93 mm |
| Core Voltage | β | 2.3 V (FLEX 10KE standard) [DATA_NEEDED: confirm exact VCCINT] |
| Speed Grade | β | -3 (fastest) |
| Process Technology | β | 0.22 Β΅m CMOS, 4-layer metal |
| Lead-free | β | no (legacy tin-lead per distributor description) |