EPF10K200EFC672-3 vs EPF10K200EGC599-1 Comparison
Detailed side-by-side comparison of EPF10K200EFC672-3 by Intel and EPF10K200EGC599-1 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EPF10K200EFC672-3 - FLEX 10KE FPGA 9984 Cells 470 I/O BGA-672 | Intel
EPF10K200EFC672-3 ObsoleteIntel
EPF10K200EGC599-1 - FLEX 10KE 200K Gates FPGA 599-CPGA | Intel / Altera
EPF10K200EGC599-1 β Last Time BuySpecification Comparison
| Parameter | EPF10K200EFC672-3 | EPF10K200EGC599-1 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Last_time_buy |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $115.00 | $880.00 |
| Series | FLEX 10KE | β |
| Number of Logic Elements / Cells | 9,984 | β |
| Number of LABs / CLBs | 1248 | β |
| Total RAM Bits | 98,304 bits (12 EABs of 8 Kbits) | 98,304 |
| Number of I/O | 470 | β |
| Number of Gates (typical) | 200,000 | β |
| Supply Voltage - Operating | 2.3 V to 2.7 V (2.5 V nominal) | β |
| Process Technology | 0.22 Β΅m CMOS | β |
| Maximum Operating Frequency | 166.67 MHz | β |
| Propagation Delay | 0.4 ns | β |
| Package / Case | 672-BBGA (27 x 27 mm, 1.0 mm pitch, FineLine BGA) | β |
| Mounting Type | Surface Mount | Through-Hole (Socket or Solder) |
| Operating Temperature | 0 Β°C to +70 Β°C (commercial) | 0C to +70C (Commercial) |
| Configuration Memory | SRAM-based (volatile, requires external configuration device) | β |
| Number of PLLs | 4 | β |
| RoHS Status | [DATA_NEEDED: rohs status] | [DATA_NEEDED: RoHS status of ceramic CPGA variant] |
| MSL Level | [DATA_NEEDED: MSL level] | β |
| Lead-Free | [DATA_NEEDED: lead-free status] | β |
| Family | β | FLEX 10KE |
| Logic Elements (LEs) | β | 9,984 |
| Typical Gates | β | 200,000 |
| Embedded Array Blocks (EABs) | β | 470 |
| Core Supply Voltage | β | 2.375 V to 2.625 V |
| I/O Voltage Tolerance | β | 5.0 V tolerant |
| Pin Count | β | 599 |
| Package Type | β | 599-BCPGA (Ceramic Pin Grid Array) |
| Package Dimensions | β | 62.48 x 62.48 mm |
| Programming Interface | β | JTAG (IEEE 1149.1) |
| PLLs | β | 4 |