EPF10K200EFC672-3 vs EPF10K200EGC599-1 Comparison

Detailed side-by-side comparison of EPF10K200EFC672-3 by Intel and EPF10K200EGC599-1 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K200EFC672-3 EPF10K200EGC599-1
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Last Time Buy
Series FLEX 10KE —
Number of Logic Elements / Cells 9,984 —
Number of LABs / CLBs 1248 —
Total RAM Bits 98,304 bits (12 EABs of 8 Kbits) 98,304
Number of I/O 470 —
Number of Gates (typical) 200,000 —
Supply Voltage - Operating 2.3 V to 2.7 V (2.5 V nominal) —
Process Technology 0.22 µm CMOS —
Maximum Operating Frequency 166.67 MHz —
Propagation Delay 0.4 ns —
Package / Case 672-BBGA (27 x 27 mm, 1.0 mm pitch, FineLine BGA) —
Mounting Type Surface Mount Through-Hole (Socket or Solder)
Operating Temperature 0 °C to +70 °C (commercial) 0C to +70C (Commercial)
Configuration Memory SRAM-based (volatile, requires external configuration device) —
Number of PLLs 4 —
RoHS Status [DATA_NEEDED: rohs status] [DATA_NEEDED: RoHS status of ceramic CPGA variant]
MSL Level [DATA_NEEDED: MSL level] —
Lead-Free [DATA_NEEDED: lead-free status] —
Family — FLEX 10KE
Logic Elements (LEs) — 9,984
Typical Gates — 200,000
Embedded Array Blocks (EABs) — 470
Core Supply Voltage — 2.375 V to 2.625 V
I/O Voltage Tolerance — 5.0 V tolerant
Pin Count — 599
Package Type — 599-BCPGA (Ceramic Pin Grid Array)
Package Dimensions — 62.48 x 62.48 mm
Programming Interface — JTAG (IEEE 1149.1)
PLLs — 4

Datasheets & Resources

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