EPF10K200EFC672-3 vs EPF10K200EGC599-1 Vergleich
Detaillierter Direktvergleich von EPF10K200EFC672-3 von Intel und EPF10K200EGC599-1 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EPF10K200EFC672-3 - FLEX 10KE FPGA 9984 Cells 470 I/O BGA-672 | Intel
EPF10K200EFC672-3 ObsoleteIntel
EPF10K200EGC599-1 - FLEX 10KE 200K Gates FPGA 599-CPGA | Intel / Altera
EPF10K200EGC599-1 ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EPF10K200EFC672-3 | EPF10K200EGC599-1 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $115,00 | $880,00 |
| Series | FLEX 10KE | — |
| Number of Logic Elements / Cells | 9,984 | — |
| Number of LABs / CLBs | 1248 | — |
| Total RAM Bits | 98,304 bits (12 EABs of 8 Kbits) | 98,304 |
| Number of I/O | 470 | — |
| Number of Gates (typical) | 200,000 | — |
| Supply Voltage - Operating | 2.3 V to 2.7 V (2.5 V nominal) | — |
| Process Technology | 0.22 µm CMOS | — |
| Maximum Operating Frequency | 166.67 MHz | — |
| Propagation Delay | 0.4 ns | — |
| Gehäuse / Bauform | 672-BBGA (27 x 27 mm, 1.0 mm pitch, FineLine BGA) | — |
| Montageart | Surface Mount | Through-Hole (Socket or Solder) |
| Betriebstemperatur | 0 °C to +70 °C (commercial) | 0C to +70C (Commercial) |
| Configuration Memory | SRAM-based (volatile, requires external configuration device) | — |
| Number of PLLs | 4 | — |
| RoHS-Status | [DATA_NEEDED: rohs status] | [DATA_NEEDED: RoHS status of ceramic CPGA variant] |
| MSL-Level | [DATA_NEEDED: MSL level] | — |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Family | — | FLEX 10KE |
| Logic Elements (LEs) | — | 9,984 |
| Typical Gates | — | 200,000 |
| Embedded Array Blocks (EABs) | — | 470 |
| Core Supply Voltage | — | 2.375 V to 2.625 V |
| I/O Voltage Tolerance | — | 5.0 V tolerant |
| Pin-Anzahl | — | 599 |
| Package Type | — | 599-BCPGA (Ceramic Pin Grid Array) |
| Package Dimensions | — | 62.48 x 62.48 mm |
| Programming Interface | — | JTAG (IEEE 1149.1) |
| PLLs | — | 4 |