EPF10K200EFC672-3 vs EPF10K200EGC599-1 비교
다음의 상세 나란히 비교: EPF10K200EFC672-3 제조: Intel 및 EPF10K200EGC599-1 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
Intel
EPF10K200EFC672-3 - FLEX 10KE FPGA 9984 Cells 470 I/O BGA-672 | Intel
EPF10K200EFC672-3 ObsoleteIntel
EPF10K200EGC599-1 - FLEX 10KE 200K Gates FPGA 599-CPGA | Intel / Altera
EPF10K200EGC599-1 ⚠ 최종 구매사양 비교
| 파라미터 | EPF10K200EFC672-3 | EPF10K200EGC599-1 |
|---|---|---|
| 브랜드 | Intel | Intel |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | Obsolete | 최종 구매 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $115.00 | $880.00 |
| Series | FLEX 10KE | — |
| Number of Logic Elements / Cells | 9,984 | — |
| Number of LABs / CLBs | 1248 | — |
| Total RAM Bits | 98,304 bits (12 EABs of 8 Kbits) | 98,304 |
| Number of I/O | 470 | — |
| Number of Gates (typical) | 200,000 | — |
| Supply Voltage - Operating | 2.3 V to 2.7 V (2.5 V nominal) | — |
| Process Technology | 0.22 µm CMOS | — |
| Maximum Operating Frequency | 166.67 MHz | — |
| Propagation Delay | 0.4 ns | — |
| 패키지 / 케이스 | 672-BBGA (27 x 27 mm, 1.0 mm pitch, FineLine BGA) | — |
| 실장 유형 | Surface Mount | Through-Hole (Socket or Solder) |
| 동작 온도 | 0 °C to +70 °C (commercial) | 0C to +70C (Commercial) |
| Configuration Memory | SRAM-based (volatile, requires external configuration device) | — |
| Number of PLLs | 4 | — |
| RoHS 상태 | [DATA_NEEDED: rohs status] | [DATA_NEEDED: RoHS status of ceramic CPGA variant] |
| MSL 레벨 | [DATA_NEEDED: MSL level] | — |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Family | — | FLEX 10KE |
| Logic Elements (LEs) | — | 9,984 |
| Typical Gates | — | 200,000 |
| Embedded Array Blocks (EABs) | — | 470 |
| Core Supply Voltage | — | 2.375 V to 2.625 V |
| I/O Voltage Tolerance | — | 5.0 V tolerant |
| 핀 수 | — | 599 |
| Package Type | — | 599-BCPGA (Ceramic Pin Grid Array) |
| Package Dimensions | — | 62.48 x 62.48 mm |
| Programming Interface | — | JTAG (IEEE 1149.1) |
| PLLs | — | 4 |