EPF10K200EFC672-3 vs EPF10K200SFI672-2N Comparison
Detailed side-by-side comparison of EPF10K200EFC672-3 by Intel and EPF10K200SFI672-2N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EPF10K200EFC672-3 - FLEX 10KE FPGA 9984 Cells 470 I/O BGA-672 | Intel
EPF10K200EFC672-3 ObsoleteSpecification Comparison
| Parameter | EPF10K200EFC672-3 | EPF10K200SFI672-2N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Obsolete |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $115.00 | $138.00 |
| Series | FLEX 10KE | β |
| Number of Logic Elements / Cells | 9,984 | β |
| Number of LABs / CLBs | 1248 | β |
| Total RAM Bits | 98,304 bits (12 EABs of 8 Kbits) | β |
| Number of I/O | 470 | β |
| Number of Gates (typical) | 200,000 | β |
| Supply Voltage - Operating | 2.3 V to 2.7 V (2.5 V nominal) | β |
| Process Technology | 0.22 Β΅m CMOS | 0.22 um CMOS |
| Maximum Operating Frequency | 166.67 MHz | β |
| Propagation Delay | 0.4 ns | β |
| Package / Case | 672-BBGA (27 x 27 mm, 1.0 mm pitch, FineLine BGA) | β |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0 Β°C to +70 Β°C (commercial) | β |
| Configuration Memory | SRAM-based (volatile, requires external configuration device) | β |
| Number of PLLs | 4 | β |
| RoHS Status | [DATA_NEEDED: rohs status] | Lead-free (N suffix) |
| MSL Level | [DATA_NEEDED: MSL level] | β |
| Lead-Free | [DATA_NEEDED: lead-free status] | β |
| Family | β | FLEX 10KE |
| Device Logic Elements | β | 9,984 |
| Typical Gates | β | 200,000 |
| Maximum System Gates | β | [DATA_NEEDED: maximum system gates] |
| Embedded Memory (EAB) | β | 12 EABs, 98,304 bits total |
| User I/Os | β | 470 |
| Core Supply Voltage | β | 2.5 V |
| I/O Supply Voltage | β | 3.3 V (5.0 V tolerant) |
| Operating Temperature Grade | β | Industrial (-40C to +85C) |
| Speed Grade | β | -2 (mid) |
| Package | β | 672-ball FBGA (FineLine BGA), 27 x 27 mm, 1.0 mm pitch |
| JTAG Boundary-Scan | β | IEEE Std. 1149.1 compliant |
| Configuration Method | β | SRAM-based (requires external boot ROM) |