EPF10K200EGC599-2 vs EPF10K200EBC600-2 Comparison

Detailed side-by-side comparison of EPF10K200EGC599-2 by Altera and EPF10K200EBC600-2 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K200EGC599-2 EPF10K200EBC600-2
Brand Altera Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $185.00 $198.00
Series FLEX 10KE FLEX-10KE
Family FLEX 10KE β€”
Logic Elements 9984 β€”
Total RAM Bits 98304 β€”
Number of I/O 470 β€”
Number of Logic Gates 200000 β€”
Supply Voltage - Core 2.375 V to 2.625 V β€”
Pin-to-Pin Logic Delay 0.6 ns β€”
Mounting Type Through Hole Surface Mount
Package / Case 599-BCPGA (62.48 x 62.48 mm) β€”
Supplier Device Package 599-CPGA β€”
Operating Temperature Grade Commercial β€”
Technology / Process CMOS, SRAM-based configuration β€”
Programmability Type SRAM (in-system reconfigurable) β€”
Configuration Interface JTAG (IEEE 1149.1) / EPC serial β€”
RoHS Status Non-compliant (lead-bearing CPGA) unknown
Logic Family β€” CMOS (SRAM-based)
Process Technology β€” 0.30 Β΅m CMOS
Typical Gate Count β€” 200,000 gates
Logic Elements (LEs) β€” 9984
Logic Array Blocks (LABs) β€” 1248
Embedded Memory (EAB) β€” 98304 bits (96 Kbits)
Maximum User I/O β€” 470 pins
Propagation Delay β€” 0.4 ns
Supply Voltage β€” 2.3 V to 2.7 V (core), 2.5/3.3 V (I/O)
I/O Standards β€” LVTTL, LVCMOS, PCI, GTL+
Package Type β€” 600-ball BGA (BGA-600)
Package Dimensions β€” 45 Γ— 45 mm
Ball Pitch β€” 1.27 mm
Package Height β€” 1.1 mm max
Operating Temperature β€” 0Β°C to +70Β°C (Commercial)
Configuration Method β€” JTAG (IEEE 1149.1), EPC2 serial PROM
Part Status β€” Obsolete

Datasheets & Resources

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