EPF10K200EGC599-2 vs EPF10K200EBC600-2 对比

详细并排对比 EPF10K200EGC599-2 出自 Altera 和 EPF10K200EBC600-2 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

规格对比

参数 EPF10K200EGC599-2 EPF10K200EBC600-2
品牌 Altera Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 Obsolete Obsolete
库存状态 有库存 有库存
单价(USD) $185.00 $198.00
Series FLEX 10KE FLEX-10KE
Family FLEX 10KE —
Logic Elements 9984 —
Total RAM Bits 98304 —
Number of I/O 470 —
Number of Logic Gates 200000 —
Supply Voltage - Core 2.375 V to 2.625 V —
Pin-to-Pin Logic Delay 0.6 ns —
安装类型 Through Hole Surface Mount
封装 / 外壳 599-BCPGA (62.48 x 62.48 mm) —
Supplier Device Package 599-CPGA —
Operating Temperature Grade Commercial —
Technology / Process CMOS, SRAM-based configuration —
Programmability Type SRAM (in-system reconfigurable) —
Configuration Interface JTAG (IEEE 1149.1) / EPC serial —
RoHS 状态 Non-compliant (lead-bearing CPGA) unknown
Logic Family — CMOS (SRAM-based)
Process Technology — 0.30 µm CMOS
Typical Gate Count — 200,000 gates
Logic Elements (LEs) — 9984
Logic Array Blocks (LABs) — 1248
Embedded Memory (EAB) — 98304 bits (96 Kbits)
Maximum User I/O — 470 pins
Propagation Delay — 0.4 ns
电源电压 — 2.3 V to 2.7 V (core), 2.5/3.3 V (I/O)
I/O Standards — LVTTL, LVCMOS, PCI, GTL+
Package Type — 600-ball BGA (BGA-600)
Package Dimensions — 45 × 45 mm
Ball Pitch — 1.27 mm
Package Height — 1.1 mm max
工作温度 — 0°C to +70°C (Commercial)
Configuration Method — JTAG (IEEE 1149.1), EPC2 serial PROM
Part Status — Obsolete

数据手册与资源

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