EPF10K200EGC599-2 vs EPF10K200EBC600-2 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K200EGC599-2 sa pamamagitan ng Altera at EPF10K200EBC600-2 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EPF10K200EGC599-2 EPF10K200EBC600-2
Brand Altera Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Obsolete Obsolete
Series FLEX 10KE FLEX-10KE
Family FLEX 10KE —
Logic Elements 9984 —
Total RAM Bits 98304 —
Number of I/O 470 —
Number of Logic Gates 200000 —
Supply Voltage - Core 2.375 V to 2.625 V —
Pin-to-Pin Logic Delay 0.6 ns —
Uri ng Pagpapasok Through Hole Surface Mount
Packhaging / Kaso 599-BCPGA (62.48 x 62.48 mm) —
Supplier Device Package 599-CPGA —
Operating Temperature Grade Commercial —
Technology / Process CMOS, SRAM-based configuration —
Programmability Type SRAM (in-system reconfigurable) —
Configuration Interface JTAG (IEEE 1149.1) / EPC serial —
Tindminan RoHS Non-compliant (lead-bearing CPGA) unknown
Logic Family — CMOS (SRAM-based)
Process Technology — 0.30 µm CMOS
Typical Gate Count — 200,000 gates
Logic Elements (LEs) — 9984
Logic Array Blocks (LABs) — 1248
Embedded Memory (EAB) — 98304 bits (96 Kbits)
Maximum User I/O — 470 pins
Propagation Delay — 0.4 ns
Volte ng Pagbibigay — 2.3 V to 2.7 V (core), 2.5/3.3 V (I/O)
I/O Standards — LVTTL, LVCMOS, PCI, GTL+
Package Type — 600-ball BGA (BGA-600)
Package Dimensions — 45 × 45 mm
Ball Pitch — 1.27 mm
Package Height — 1.1 mm max
Temperature na Operasyon — 0°C to +70°C (Commercial)
Configuration Method — JTAG (IEEE 1149.1), EPC2 serial PROM
Part Status — Obsolete

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