EPF10K200SFI672-2N vs EPF10K200EFC672-3 Comparison

Detailed side-by-side comparison of EPF10K200SFI672-2N by Intel and EPF10K200EFC672-3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K200SFI672-2N EPF10K200EFC672-3
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Family FLEX 10KE —
Device Logic Elements 9,984 —
Typical Gates 200,000 —
Maximum System Gates [DATA_NEEDED: maximum system gates] —
Embedded Memory (EAB) 12 EABs, 98,304 bits total —
User I/Os 470 —
Process Technology 0.22 um CMOS 0.22 µm CMOS
Core Supply Voltage 2.5 V —
I/O Supply Voltage 3.3 V (5.0 V tolerant) —
Operating Temperature Grade Industrial (-40C to +85C) —
Speed Grade -2 (mid) —
Package 672-ball FBGA (FineLine BGA), 27 x 27 mm, 1.0 mm pitch —
Mounting Type Surface Mount Surface Mount
JTAG Boundary-Scan IEEE Std. 1149.1 compliant —
Configuration Method SRAM-based (requires external boot ROM) —
RoHS Status Lead-free (N suffix) [DATA_NEEDED: rohs status]
Series — FLEX 10KE
Number of Logic Elements / Cells — 9,984
Number of LABs / CLBs — 1248
Total RAM Bits — 98,304 bits (12 EABs of 8 Kbits)
Number of I/O — 470
Number of Gates (typical) — 200,000
Supply Voltage - Operating — 2.3 V to 2.7 V (2.5 V nominal)
Maximum Operating Frequency — 166.67 MHz
Propagation Delay — 0.4 ns
Package / Case — 672-BBGA (27 x 27 mm, 1.0 mm pitch, FineLine BGA)
Operating Temperature — 0 °C to +70 °C (commercial)
Configuration Memory — SRAM-based (volatile, requires external configuration device)
Number of PLLs — 4
MSL Level — [DATA_NEEDED: MSL level]
Lead-Free — [DATA_NEEDED: lead-free status]

Datasheets & Resources

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