EPF10K200SFI672-2N vs EPF10K200EFC672-3 Vergleich

Detaillierter Direktvergleich von EPF10K200SFI672-2N von Intel und EPF10K200EFC672-3 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EPF10K200SFI672-2N EPF10K200EFC672-3
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Obsolete Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $138,00 $115,00
Family FLEX 10KE —
Device Logic Elements 9,984 —
Typical Gates 200,000 —
Maximum System Gates [DATA_NEEDED: maximum system gates] —
Embedded Memory (EAB) 12 EABs, 98,304 bits total —
User I/Os 470 —
Process Technology 0.22 um CMOS 0.22 µm CMOS
Core Supply Voltage 2.5 V —
I/O Supply Voltage 3.3 V (5.0 V tolerant) —
Operating Temperature Grade Industrial (-40C to +85C) —
Speed Grade -2 (mid) —
Gehäuse 672-ball FBGA (FineLine BGA), 27 x 27 mm, 1.0 mm pitch —
Montageart Surface Mount Surface Mount
JTAG Boundary-Scan IEEE Std. 1149.1 compliant —
Configuration Method SRAM-based (requires external boot ROM) —
RoHS-Status Lead-free (N suffix) [DATA_NEEDED: rohs status]
Series — FLEX 10KE
Number of Logic Elements / Cells — 9,984
Number of LABs / CLBs — 1248
Total RAM Bits — 98,304 bits (12 EABs of 8 Kbits)
Number of I/O — 470
Number of Gates (typical) — 200,000
Supply Voltage - Operating — 2.3 V to 2.7 V (2.5 V nominal)
Maximum Operating Frequency — 166.67 MHz
Propagation Delay — 0.4 ns
Gehäuse / Bauform — 672-BBGA (27 x 27 mm, 1.0 mm pitch, FineLine BGA)
Betriebstemperatur — 0 °C to +70 °C (commercial)
Configuration Memory — SRAM-based (volatile, requires external configuration device)
Number of PLLs — 4
MSL-Level — [DATA_NEEDED: MSL level]
Lead-Free — [DATA_NEEDED: lead-free status]

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