EPF10K200SFI672-2N vs EPF10K200EFC672-3 Comparación
Comparación detallada lado a lado de EPF10K200SFI672-2N por Intel y EPF10K200EFC672-3 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EPF10K200EFC672-3 - FLEX 10KE FPGA 9984 Cells 470 I/O BGA-672 | Intel
EPF10K200EFC672-3 ObsoleteComparación de especificaciones
| Parámetro | EPF10K200SFI672-2N | EPF10K200EFC672-3 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $138,00 | $115,00 |
| Family | FLEX 10KE | — |
| Device Logic Elements | 9,984 | — |
| Typical Gates | 200,000 | — |
| Maximum System Gates | [DATA_NEEDED: maximum system gates] | — |
| Embedded Memory (EAB) | 12 EABs, 98,304 bits total | — |
| User I/Os | 470 | — |
| Process Technology | 0.22 um CMOS | 0.22 µm CMOS |
| Core Supply Voltage | 2.5 V | — |
| I/O Supply Voltage | 3.3 V (5.0 V tolerant) | — |
| Operating Temperature Grade | Industrial (-40C to +85C) | — |
| Speed Grade | -2 (mid) | — |
| Encapsulado | 672-ball FBGA (FineLine BGA), 27 x 27 mm, 1.0 mm pitch | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| JTAG Boundary-Scan | IEEE Std. 1149.1 compliant | — |
| Configuration Method | SRAM-based (requires external boot ROM) | — |
| Estado RoHS | Lead-free (N suffix) | [DATA_NEEDED: rohs status] |
| Series | — | FLEX 10KE |
| Number of Logic Elements / Cells | — | 9,984 |
| Number of LABs / CLBs | — | 1248 |
| Total RAM Bits | — | 98,304 bits (12 EABs of 8 Kbits) |
| Number of I/O | — | 470 |
| Number of Gates (typical) | — | 200,000 |
| Supply Voltage - Operating | — | 2.3 V to 2.7 V (2.5 V nominal) |
| Maximum Operating Frequency | — | 166.67 MHz |
| Propagation Delay | — | 0.4 ns |
| Encapsulado / Carcasa | — | 672-BBGA (27 x 27 mm, 1.0 mm pitch, FineLine BGA) |
| Temperatura de funcionamiento | — | 0 °C to +70 °C (commercial) |
| Configuration Memory | — | SRAM-based (volatile, requires external configuration device) |
| Number of PLLs | — | 4 |
| Nivel MSL | — | [DATA_NEEDED: MSL level] |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |