EPF10K200SFI672-2N vs EPF10K200EFC672-3 비교
다음의 상세 나란히 비교: EPF10K200SFI672-2N 제조: Intel 및 EPF10K200EFC672-3 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
Intel
EPF10K200EFC672-3 - FLEX 10KE FPGA 9984 Cells 470 I/O BGA-672 | Intel
EPF10K200EFC672-3 Obsolete사양 비교
| 파라미터 | EPF10K200SFI672-2N | EPF10K200EFC672-3 |
|---|---|---|
| 브랜드 | Intel | Intel |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | Obsolete | Obsolete |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $138.00 | $115.00 |
| Family | FLEX 10KE | — |
| Device Logic Elements | 9,984 | — |
| Typical Gates | 200,000 | — |
| Maximum System Gates | [DATA_NEEDED: maximum system gates] | — |
| Embedded Memory (EAB) | 12 EABs, 98,304 bits total | — |
| User I/Os | 470 | — |
| Process Technology | 0.22 um CMOS | 0.22 µm CMOS |
| Core Supply Voltage | 2.5 V | — |
| I/O Supply Voltage | 3.3 V (5.0 V tolerant) | — |
| Operating Temperature Grade | Industrial (-40C to +85C) | — |
| Speed Grade | -2 (mid) | — |
| 패키지 | 672-ball FBGA (FineLine BGA), 27 x 27 mm, 1.0 mm pitch | — |
| 실장 유형 | Surface Mount | Surface Mount |
| JTAG Boundary-Scan | IEEE Std. 1149.1 compliant | — |
| Configuration Method | SRAM-based (requires external boot ROM) | — |
| RoHS 상태 | Lead-free (N suffix) | [DATA_NEEDED: rohs status] |
| Series | — | FLEX 10KE |
| Number of Logic Elements / Cells | — | 9,984 |
| Number of LABs / CLBs | — | 1248 |
| Total RAM Bits | — | 98,304 bits (12 EABs of 8 Kbits) |
| Number of I/O | — | 470 |
| Number of Gates (typical) | — | 200,000 |
| Supply Voltage - Operating | — | 2.3 V to 2.7 V (2.5 V nominal) |
| Maximum Operating Frequency | — | 166.67 MHz |
| Propagation Delay | — | 0.4 ns |
| 패키지 / 케이스 | — | 672-BBGA (27 x 27 mm, 1.0 mm pitch, FineLine BGA) |
| 동작 온도 | — | 0 °C to +70 °C (commercial) |
| Configuration Memory | — | SRAM-based (volatile, requires external configuration device) |
| Number of PLLs | — | 4 |
| MSL 레벨 | — | [DATA_NEEDED: MSL level] |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |