EPF10K200SFI672-2N vs EPF10K200EFC672-3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K200SFI672-2N sa pamamagitan ng Intel at EPF10K200EFC672-3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EPF10K200EFC672-3 - FLEX 10KE FPGA 9984 Cells 470 I/O BGA-672 | Intel
EPF10K200EFC672-3 ObsoletePagsanggunian na paghahambing
| Parametro | EPF10K200SFI672-2N | EPF10K200EFC672-3 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Family | FLEX 10KE | — |
| Device Logic Elements | 9,984 | — |
| Typical Gates | 200,000 | — |
| Maximum System Gates | [DATA_NEEDED: maximum system gates] | — |
| Embedded Memory (EAB) | 12 EABs, 98,304 bits total | — |
| User I/Os | 470 | — |
| Process Technology | 0.22 um CMOS | 0.22 µm CMOS |
| Core Supply Voltage | 2.5 V | — |
| I/O Supply Voltage | 3.3 V (5.0 V tolerant) | — |
| Operating Temperature Grade | Industrial (-40C to +85C) | — |
| Speed Grade | -2 (mid) | — |
| Packhaging | 672-ball FBGA (FineLine BGA), 27 x 27 mm, 1.0 mm pitch | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| JTAG Boundary-Scan | IEEE Std. 1149.1 compliant | — |
| Configuration Method | SRAM-based (requires external boot ROM) | — |
| Tindminan RoHS | Lead-free (N suffix) | [DATA_NEEDED: rohs status] |
| Series | — | FLEX 10KE |
| Number of Logic Elements / Cells | — | 9,984 |
| Number of LABs / CLBs | — | 1248 |
| Total RAM Bits | — | 98,304 bits (12 EABs of 8 Kbits) |
| Number of I/O | — | 470 |
| Number of Gates (typical) | — | 200,000 |
| Supply Voltage - Operating | — | 2.3 V to 2.7 V (2.5 V nominal) |
| Maximum Operating Frequency | — | 166.67 MHz |
| Propagation Delay | — | 0.4 ns |
| Packhaging / Kaso | — | 672-BBGA (27 x 27 mm, 1.0 mm pitch, FineLine BGA) |
| Temperature na Operasyon | — | 0 °C to +70 °C (commercial) |
| Configuration Memory | — | SRAM-based (volatile, requires external configuration device) |
| Number of PLLs | — | 4 |
| Level ng MSL | — | [DATA_NEEDED: MSL level] |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |