EPF10K250EFC672-1 vs EPF10K250EFC672-3 Comparison
Detailed side-by-side comparison of EPF10K250EFC672-1 by Intel and EPF10K250EFC672-3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EPF10K250EFC672-1 | EPF10K250EFC672-3 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Obsolete |
| Family | FLEX 10KE | FLEX 10KE |
| Logic Family | CMOS | — |
| Typical System Gates | 250,000 | — |
| Maximum User I/Os | 470 | — |
| Total Pins | 672 | — |
| Package Type | BGA-672 | — |
| Package Size | 45 x 45 mm | — |
| Ball Pitch | 1.27 mm | 1.0 mm |
| Package Shape | Square | — |
| Terminal Form | Ball | — |
| Operating Temperature | 0C to +70C (Commercial) | — |
| Propagation Delay | 0.4 ns | — |
| Programming Technology | In-system, SRAM-based | — |
| RoHS Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status - 672-FBGA part is non-RoHS per Fly-Wing listing] |
| Mounting Type | Surface Mount | Surface Mount |
| Configuration Interface | Serial (passive/active) | — |
| Speed Grade | -1 | -3 (fastest) |
| Product Type | — | FPGA (Field Programmable Gate Array) |
| Maximum Typical Gates | — | 250,000 |
| Logic Elements (LEs) | — | 12,160 |
| Embedded Memory (EAB) | — | 655,360 bits (80 EABs x 2,048 bits each) |
| Logic Array Blocks (LABs) | — | 392 (8 LEs per LAB) |
| User I/O Pins | — | 470 |
| Core Supply Voltage | — | 2.5 V |
| I/O Supply Voltage | — | MultiVolt: 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Temperature Grade | — | Commercial (0C to +70C) |
| Package | — | 672-ball FineLine BGA (FC) |
| Configuration Mode | — | JTAG (IEEE 1149.1) ISP / serial / parallel, external EPCx PROM |
| Process Technology | — | 0.25 um CMOS, 5-layer metal |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |