EPF10K250EFC672-1 vs EPF10K250EFC672-3 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K250EFC672-1 sa pamamagitan ng Intel at EPF10K250EFC672-3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EPF10K250EFC672-1 EPF10K250EFC672-3
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Obsolete Obsolete
Family FLEX 10KE FLEX 10KE
Logic Family CMOS —
Typical System Gates 250,000 —
Maximum User I/Os 470 —
Total Pins 672 —
Package Type BGA-672 —
Package Size 45 x 45 mm —
Ball Pitch 1.27 mm 1.0 mm
Package Shape Square —
Terminal Form Ball —
Temperature na Operasyon 0C to +70C (Commercial) —
Propagation Delay 0.4 ns —
Programming Technology In-system, SRAM-based —
Tindminan RoHS [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status - 672-FBGA part is non-RoHS per Fly-Wing listing]
Uri ng Pagpapasok Surface Mount Surface Mount
Configuration Interface Serial (passive/active) —
Speed Grade -1 -3 (fastest)
Product Type — FPGA (Field Programmable Gate Array)
Maximum Typical Gates — 250,000
Logic Elements (LEs) — 12,160
Embedded Memory (EAB) — 655,360 bits (80 EABs x 2,048 bits each)
Logic Array Blocks (LABs) — 392 (8 LEs per LAB)
User I/O Pins — 470
Core Supply Voltage — 2.5 V
I/O Supply Voltage — MultiVolt: 1.5 V / 1.8 V / 2.5 V / 3.3 V
Temperature Grade — Commercial (0C to +70C)
Packhaging — 672-ball FineLine BGA (FC)
Configuration Mode — JTAG (IEEE 1149.1) ISP / serial / parallel, external EPCx PROM
Process Technology — 0.25 um CMOS, 5-layer metal
Lead-Free — [DATA_NEEDED: lead-free status]

Mga Datasheets at Resources

Tingnan ang Lahat ng mga Produkto Lumikha ng BOM Hilingin ang Kita