EPF10K250EFC672-1 vs EPF10K250EFC672-3 对比

详细并排对比 EPF10K250EFC672-1 出自 Intel 和 EPF10K250EFC672-3 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

规格对比

参数 EPF10K250EFC672-1 EPF10K250EFC672-3
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 Obsolete Obsolete
库存状态 有库存 有库存
单价(USD) $115.00 $99.50
Family FLEX 10KE FLEX 10KE
Logic Family CMOS —
Typical System Gates 250,000 —
Maximum User I/Os 470 —
Total Pins 672 —
Package Type BGA-672 —
Package Size 45 x 45 mm —
Ball Pitch 1.27 mm 1.0 mm
Package Shape Square —
Terminal Form Ball —
工作温度 0C to +70C (Commercial) —
Propagation Delay 0.4 ns —
Programming Technology In-system, SRAM-based —
RoHS 状态 [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status - 672-FBGA part is non-RoHS per Fly-Wing listing]
安装类型 Surface Mount Surface Mount
Configuration Interface Serial (passive/active) —
Speed Grade -1 -3 (fastest)
Product Type — FPGA (Field Programmable Gate Array)
Maximum Typical Gates — 250,000
Logic Elements (LEs) — 12,160
Embedded Memory (EAB) — 655,360 bits (80 EABs x 2,048 bits each)
Logic Array Blocks (LABs) — 392 (8 LEs per LAB)
User I/O Pins — 470
Core Supply Voltage — 2.5 V
I/O Supply Voltage — MultiVolt: 1.5 V / 1.8 V / 2.5 V / 3.3 V
Temperature Grade — Commercial (0C to +70C)
封装 — 672-ball FineLine BGA (FC)
Configuration Mode — JTAG (IEEE 1149.1) ISP / serial / parallel, external EPCx PROM
Process Technology — 0.25 um CMOS, 5-layer metal
Lead-Free — [DATA_NEEDED: lead-free status]

数据手册与资源

浏览全部产品 创建 BOM 获取报价