EPF10K250EFI672-3 vs EPF10K250EFC672-1 Comparison
Detailed side-by-side comparison of EPF10K250EFI672-3 by Intel and EPF10K250EFC672-1 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EPF10K250EFI672-3 | EPF10K250EFC672-1 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Nrnd | Obsolete |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $125.00 | $115.00 |
| Family | FLEX 10KE | FLEX 10KE |
| Typical Gates | 250,000 | β |
| Logic Elements | [DATA_NEEDED: exact LE count] | β |
| User I/O Pins | 470 | β |
| Embedded Array Blocks (EABs) | 12 | β |
| EAB Dual-Port Width | Up to 16-bit | β |
| Maximum EAB Memory | [DATA_NEEDED: bits per EAB] | β |
| Propagation Delay (tpd) | 0.4 ns (typical, -3 speed grade) | β |
| Core Supply Voltage | 2.5 V | β |
| I/O Supply Voltage | 2.5 V / 3.3 V (multiVolt I/O) | β |
| Package | 672-ball FineLine BGA, 1.27 mm pitch | β |
| Process Technology | CMOS, SRAM-based configuration | β |
| Configuration Interface | JTAG / ByteBlaster (EPC2/EPC8 PROM) | Serial (passive/active) |
| Operating Temperature | 0 Β°C to 70 Β°C (commercial) | 0C to +70C (Commercial) |
| Design Entry | EDIF 2 0 0 / 3 0 0, LPM, VHDL, Verilog | β |
| RoHS Status | Unknown (legacy Altera non-RoHS device) | [DATA_NEEDED: RoHS status] |
| Logic Family | β | CMOS |
| Typical System Gates | β | 250,000 |
| Maximum User I/Os | β | 470 |
| Total Pins | β | 672 |
| Package Type | β | BGA-672 |
| Package Size | β | 45 x 45 mm |
| Ball Pitch | β | 1.27 mm |
| Package Shape | β | Square |
| Terminal Form | β | Ball |
| Propagation Delay | β | 0.4 ns |
| Programming Technology | β | In-system, SRAM-based |
| Mounting Type | β | Surface Mount |
| Speed Grade | β | -1 |