EPF10K250EFI672-3 vs EPF10K250EFC672-1 Comparaison
Comparaison détaillée côte à côte de EPF10K250EFI672-3 par Intel et EPF10K250EFC672-1 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EPF10K250EFI672-3 | EPF10K250EFC672-1 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | NRND | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $125,00 | $115,00 |
| Family | FLEX 10KE | FLEX 10KE |
| Typical Gates | 250,000 | — |
| Logic Elements | [DATA_NEEDED: exact LE count] | — |
| User I/O Pins | 470 | — |
| Embedded Array Blocks (EABs) | 12 | — |
| EAB Dual-Port Width | Up to 16-bit | — |
| Maximum EAB Memory | [DATA_NEEDED: bits per EAB] | — |
| Propagation Delay (tpd) | 0.4 ns (typical, -3 speed grade) | — |
| Core Supply Voltage | 2.5 V | — |
| I/O Supply Voltage | 2.5 V / 3.3 V (multiVolt I/O) | — |
| Boîtier | 672-ball FineLine BGA, 1.27 mm pitch | — |
| Process Technology | CMOS, SRAM-based configuration | — |
| Configuration Interface | JTAG / ByteBlaster (EPC2/EPC8 PROM) | Serial (passive/active) |
| Température de fonctionnement | 0 °C to 70 °C (commercial) | 0C to +70C (Commercial) |
| Design Entry | EDIF 2 0 0 / 3 0 0, LPM, VHDL, Verilog | — |
| Statut RoHS | Unknown (legacy Altera non-RoHS device) | [DATA_NEEDED: RoHS status] |
| Logic Family | — | CMOS |
| Typical System Gates | — | 250,000 |
| Maximum User I/Os | — | 470 |
| Total Pins | — | 672 |
| Package Type | — | BGA-672 |
| Package Size | — | 45 x 45 mm |
| Ball Pitch | — | 1.27 mm |
| Package Shape | — | Square |
| Terminal Form | — | Ball |
| Propagation Delay | — | 0.4 ns |
| Programming Technology | — | In-system, SRAM-based |
| Type de montage | — | Surface Mount |
| Speed Grade | — | -1 |