EPF10K250EFI672-3 vs EPF10K250EFC672-1 对比
详细并排对比 EPF10K250EFI672-3 出自 Intel 和 EPF10K250EFC672-1 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EPF10K250EFI672-3 | EPF10K250EFC672-1 |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 不推荐新设计 | Obsolete |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $125.00 | $115.00 |
| Family | FLEX 10KE | FLEX 10KE |
| Typical Gates | 250,000 | — |
| Logic Elements | [DATA_NEEDED: exact LE count] | — |
| User I/O Pins | 470 | — |
| Embedded Array Blocks (EABs) | 12 | — |
| EAB Dual-Port Width | Up to 16-bit | — |
| Maximum EAB Memory | [DATA_NEEDED: bits per EAB] | — |
| Propagation Delay (tpd) | 0.4 ns (typical, -3 speed grade) | — |
| Core Supply Voltage | 2.5 V | — |
| I/O Supply Voltage | 2.5 V / 3.3 V (multiVolt I/O) | — |
| 封装 | 672-ball FineLine BGA, 1.27 mm pitch | — |
| Process Technology | CMOS, SRAM-based configuration | — |
| Configuration Interface | JTAG / ByteBlaster (EPC2/EPC8 PROM) | Serial (passive/active) |
| 工作温度 | 0 °C to 70 °C (commercial) | 0C to +70C (Commercial) |
| Design Entry | EDIF 2 0 0 / 3 0 0, LPM, VHDL, Verilog | — |
| RoHS 状态 | Unknown (legacy Altera non-RoHS device) | [DATA_NEEDED: RoHS status] |
| Logic Family | — | CMOS |
| Typical System Gates | — | 250,000 |
| Maximum User I/Os | — | 470 |
| Total Pins | — | 672 |
| Package Type | — | BGA-672 |
| Package Size | — | 45 x 45 mm |
| Ball Pitch | — | 1.27 mm |
| Package Shape | — | Square |
| Terminal Form | — | Ball |
| Propagation Delay | — | 0.4 ns |
| Programming Technology | — | In-system, SRAM-based |
| 安装类型 | — | Surface Mount |
| Speed Grade | — | -1 |