EPF10K250EFI672-3 vs EPF10K250EFC672-1 Vergleich
Detaillierter Direktvergleich von EPF10K250EFI672-3 von Intel und EPF10K250EFC672-1 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EPF10K250EFI672-3 | EPF10K250EFC672-1 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $125,00 | $115,00 |
| Family | FLEX 10KE | FLEX 10KE |
| Typical Gates | 250,000 | — |
| Logic Elements | [DATA_NEEDED: exact LE count] | — |
| User I/O Pins | 470 | — |
| Embedded Array Blocks (EABs) | 12 | — |
| EAB Dual-Port Width | Up to 16-bit | — |
| Maximum EAB Memory | [DATA_NEEDED: bits per EAB] | — |
| Propagation Delay (tpd) | 0.4 ns (typical, -3 speed grade) | — |
| Core Supply Voltage | 2.5 V | — |
| I/O Supply Voltage | 2.5 V / 3.3 V (multiVolt I/O) | — |
| Gehäuse | 672-ball FineLine BGA, 1.27 mm pitch | — |
| Process Technology | CMOS, SRAM-based configuration | — |
| Configuration Interface | JTAG / ByteBlaster (EPC2/EPC8 PROM) | Serial (passive/active) |
| Betriebstemperatur | 0 °C to 70 °C (commercial) | 0C to +70C (Commercial) |
| Design Entry | EDIF 2 0 0 / 3 0 0, LPM, VHDL, Verilog | — |
| RoHS-Status | Unknown (legacy Altera non-RoHS device) | [DATA_NEEDED: RoHS status] |
| Logic Family | — | CMOS |
| Typical System Gates | — | 250,000 |
| Maximum User I/Os | — | 470 |
| Total Pins | — | 672 |
| Package Type | — | BGA-672 |
| Package Size | — | 45 x 45 mm |
| Ball Pitch | — | 1.27 mm |
| Package Shape | — | Square |
| Terminal Form | — | Ball |
| Propagation Delay | — | 0.4 ns |
| Programming Technology | — | In-system, SRAM-based |
| Montageart | — | Surface Mount |
| Speed Grade | — | -1 |