EPF10K30ETC144-3N vs EPF10K30ETC144-2 Comparison
Detailed side-by-side comparison of EPF10K30ETC144-3N by Intel and EPF10K30ETC144-2 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EPF10K30ETC144-3N | EPF10K30ETC144-2 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | NRND | Obsolete |
| Family | FLEX 10KE | FLEX 10KE |
| Logic Family | CMOS | — |
| Typical Gates | 30,000 | 30,000 |
| Logic Elements / Cells | 1,728 | — |
| Logic Array Blocks (LABs) | 216 | 216 |
| Embedded Memory Bits | 24,576 | 24,576 |
| User I/Os | 102 | — |
| Number of Pins | 144 | — |
| Package Type | TQFP-144 (22 × 22 mm, 0.5 mm pitch) | — |
| Package Code | LFQFP | — |
| Terminal Form | Gull Wing | — |
| Mounting Type | Surface Mount | Surface Mount |
| Technology | 0.22 µm CMOS, SRAM-based | — |
| Core Supply Voltage (VCCINT) | 2.5 V | — |
| Operating Temperature | 0 °C to 70 °C (Commercial) | 0C to +70C (Commercial) |
| Propagation Delay | 0.6 ns (typical) | — |
| Internal Frequency | [DATA_NEEDED: internal frequency max] | up to 80 MHz |
| Programming Method | JTAG (IEEE 1149.1), in-system SRAM configuration | — |
| Configuration Memory | Volatile SRAM (requires external configuration device) | — |
| RoHS Status | [DATA_NEEDED: RoHS status] | Compliant (lead-free) |
| Series | — | FLEX 10KE |
| Logic Elements | — | 1,728 |
| Maximum User I/Os | — | 102 |
| Embedded Array Blocks (EABs) | — | 6 |
| Package | — | 144-LQFP (TQFP, 20x20 mm) |
| Speed Grade | — | -2 |
| Core Voltage (VCCINT) | — | 2.5 V (2.375 V to 2.625 V) |
| I/O Voltage (VCCIO) | — | 2.5 V / 3.3 V / 5.0 V (MultiVolt) |
| Propagation Delay (typ.) | — | 0.6 ns |
| Configuration Method | — | SRAM, JTAG (IEEE 1149.1) |
| Process Technology | — | CMOS, SRAM-based |