EPF10K30ETC144-3N vs EPF10K30ETC144-2 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K30ETC144-3N sa pamamagitan ng Intel at EPF10K30ETC144-2 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EPF10K30ETC144-3N EPF10K30ETC144-2
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle NRND Obsolete
Family FLEX 10KE FLEX 10KE
Logic Family CMOS —
Typical Gates 30,000 30,000
Logic Elements / Cells 1,728 —
Logic Array Blocks (LABs) 216 216
Embedded Memory Bits 24,576 24,576
User I/Os 102 —
Bilang ng Pins 144 —
Package Type TQFP-144 (22 × 22 mm, 0.5 mm pitch) —
Package Code LFQFP —
Terminal Form Gull Wing —
Uri ng Pagpapasok Surface Mount Surface Mount
Technology 0.22 µm CMOS, SRAM-based —
Core Supply Voltage (VCCINT) 2.5 V —
Temperature na Operasyon 0 °C to 70 °C (Commercial) 0C to +70C (Commercial)
Propagation Delay 0.6 ns (typical) —
Internal Frequency [DATA_NEEDED: internal frequency max] up to 80 MHz
Programming Method JTAG (IEEE 1149.1), in-system SRAM configuration —
Configuration Memory Volatile SRAM (requires external configuration device) —
Tindminan RoHS [DATA_NEEDED: RoHS status] Compliant (lead-free)
Series — FLEX 10KE
Logic Elements — 1,728
Maximum User I/Os — 102
Embedded Array Blocks (EABs) — 6
Packhaging — 144-LQFP (TQFP, 20x20 mm)
Speed Grade — -2
Core Voltage (VCCINT) — 2.5 V (2.375 V to 2.625 V)
I/O Voltage (VCCIO) — 2.5 V / 3.3 V / 5.0 V (MultiVolt)
Propagation Delay (typ.) — 0.6 ns
Configuration Method — SRAM, JTAG (IEEE 1149.1)
Process Technology — CMOS, SRAM-based

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