EPF6016AFC256-2 vs EPF6016AFC256-3 Comparison

Detailed side-by-side comparison of EPF6016AFC256-2 by Intel and EPF6016AFC256-3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF6016AFC256-2 EPF6016AFC256-3
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status NRND Obsolete
Family FLEX 6000 FLEX 6000
Device Type Field-Programmable Gate Array (FPGA) FPGA (Field Programmable Gate Array)
Typical Gates 16,000 —
Logic Elements 1,320 —
Embedded Array Blocks (EABs) 4 x 2,048 bits —
Maximum User I/Os 171 —
Maximum Internal Frequency 172 MHz 142.86 MHz
Supply Voltage (VCCINT) 3.0 V to 3.6 V —
Process Technology 0.42 um CMOS SRAM 0.42 µm CMOS
Configuration Method SRAM, JTAG (IEEE 1149.1) SRAM (volatile, requires external PROM)
Operating Temperature 0C to 85C (commercial) 0 °C to +85 °C (commercial)
Package 256-ball FBGA (FineLine BGA), 17 x 17 mm 256-ball FineLine BGA (FBGA)
Mounting Type Surface Mount Surface Mount (BGA)
RoHS Status Compliant —
Lead-Free Yes —
Equivalent Gates — 16K
Logic Elements (LEs) — 1320
Logic Array Blocks (LABs) — 132
User I/Os — 171
Edge Rate — 172 MHz
Core Supply Voltage — 3.3 V
Pin Count — 256
Speed Grade — -3
Programming Interface — JTAG (IEEE 1149.1)

Datasheets & Resources

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