EPF6016AFC256-2 vs EPF6016AFC256-3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPF6016AFC256-2 sa pamamagitan ng Intel at EPF6016AFC256-3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EPF6016AFC256-2 | EPF6016AFC256-3 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Obsolete |
| Family | FLEX 6000 | FLEX 6000 |
| Device Type | Field-Programmable Gate Array (FPGA) | FPGA (Field Programmable Gate Array) |
| Typical Gates | 16,000 | — |
| Logic Elements | 1,320 | — |
| Embedded Array Blocks (EABs) | 4 x 2,048 bits | — |
| Maximum User I/Os | 171 | — |
| Maximum Internal Frequency | 172 MHz | 142.86 MHz |
| Supply Voltage (VCCINT) | 3.0 V to 3.6 V | — |
| Process Technology | 0.42 um CMOS SRAM | 0.42 µm CMOS |
| Configuration Method | SRAM, JTAG (IEEE 1149.1) | SRAM (volatile, requires external PROM) |
| Temperature na Operasyon | 0C to 85C (commercial) | 0 °C to +85 °C (commercial) |
| Packhaging | 256-ball FBGA (FineLine BGA), 17 x 17 mm | 256-ball FineLine BGA (FBGA) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Tindminan RoHS | Compliant | — |
| Lead-Free | Yes | — |
| Equivalent Gates | — | 16K |
| Logic Elements (LEs) | — | 1320 |
| Logic Array Blocks (LABs) | — | 132 |
| User I/Os | — | 171 |
| Edge Rate | — | 172 MHz |
| Core Supply Voltage | — | 3.3 V |
| Bilang ng Pin | — | 256 |
| Speed Grade | — | -3 |
| Programming Interface | — | JTAG (IEEE 1149.1) |