EPF6016ATC100-3 vs EPF6010ATC100-3N Comparison
Detailed side-by-side comparison of EPF6016ATC100-3 by Intel and EPF6010ATC100-3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EPF6010ATC100-3N - FLEX 6000 FPGA, 880 Cells, 100-TQFP | Intel
EPF6010ATC100-3N ⚠ Last Time BuySpecification Comparison
| Parameter | EPF6016ATC100-3 | EPF6010ATC100-3N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | NRND | Last Time Buy |
| Family | FLEX 6000 | FLEX 6000 |
| Device Type | FPGA (Field Programmable Gate Array) | — |
| Logic Elements (LEs) | 1320 | — |
| Typical Gates | 16000 | — |
| User I/Os | 81 | 71 |
| Internal Frequency | 142.86 MHz | — |
| Process Technology | 0.42 µm CMOS SRAM | 0.42 µm CMOS |
| Supply Voltage (Core) | 3.3 V | — |
| Speed Grade | -3 | -3 |
| Package | 100-pin TQFP | 100-pin TQFP (14 x 14 x 1.4 mm) |
| Pin Count | 100 | — |
| Operating Temperature | 0°C to 85°C | 0 °C to +70 °C (commercial) |
| Configuration Method | SRAM, JTAG (IEEE 1149.1), ByteBlaster/BitBlaster | — |
| Mounting Type | Surface Mount | Surface Mount |
| RoHS Status | [DATA_NEEDED: current RoHS status - older FLEX 6000 parts often non-RoHS] | Compliant |
| Logic Elements / Cells | — | 880 |
| Equivalent Gate Count | — | 10,000 gates |
| Logic Array Blocks (LABs) | — | 88 |
| Supply Voltage (Operating) | — | 3.0 V to 3.6 V |
| Maximum Internal Frequency | — | 142.86 MHz |
| Programming Method | — | In-system SRAM via ByteBlaster/BitBlaster |
| MSL Level | — | 3 (168 hours) |