EPF8282ATC100-3 vs EPF8282ATC100-2 Comparison
Detailed side-by-side comparison of EPF8282ATC100-3 by Intel and EPF8282ATC100-2 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EPF8282ATC100-3 | EPF8282ATC100-2 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Active |
| Family | FLEX 8000 | FLEX 8000 |
| Logic Cells (LEs) | 208 | — |
| Usable Gates | 2,500 | 2,500 |
| Typical Gates Equivalent | 12,000 | — |
| Maximum User I/O | 78 | — |
| Number of Logic Array Blocks (LABs) | 26 | — |
| Embedded Array Blocks (EABs) | 6 | — |
| Total RAM Bits | 12 Kbits | — |
| Process Technology | 0.42 micron CMOS SRAM | 0.42 µm CMOS |
| Supply Voltage (Core) | 5 V | — |
| MultiVolt I/O Support | 3.3 V / 5 V | — |
| Maximum Frequency | 125 MHz | — |
| Speed Grade | -3 | -2 |
| Package | 100-pin TQFP (100-TQFP) | 100-pin TQFP |
| Configuration Method | SRAM, EPC1/EPC1064/EPC1213/EPC1441, microprocessor | — |
| Operating Temperature (Commercial) | 0 C to +70 C | — |
| In-Circuit Reconfigurable | Yes (ICR) | — |
| Boundary Scan | JTAG IEEE 1149.1 | — |
| Logic Cells | — | 208 |
| Logic Array Blocks (LABs) | — | 26 |
| User I/Os | — | 78 |
| Flip-Flops | — | 282 |
| Supply Voltage | — | 5 V |
| Operating Temperature | — | 0 °C to 70 °C (Commercial) |
| Mounting Type | — | Surface Mount |
| Configuration Memory | — | SRAM (volatile, requires external boot) |
| Development Tool | — | Altera MAX+PLUS II |
| RoHS Status | — | [DATA_NEEDED: RoHS status] |