EPF8282ATC100-3 vs EPF8282ATI100-3S Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EPF8282ATC100-3 sa pamamagitan ng Intel at EPF8282ATI100-3S sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EPF8282ATC100-3 EPF8282ATI100-3S
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Obsolete NRND
Family FLEX 8000 FLEX 8000
Logic Cells (LEs) 208 —
Usable Gates 2,500 —
Typical Gates Equivalent 12,000 —
Maximum User I/O 78 —
Number of Logic Array Blocks (LABs) 26 —
Embedded Array Blocks (EABs) 6 —
Total RAM Bits 12 Kbits [DATA_NEEDED: embedded RAM bits]
Process Technology 0.42 micron CMOS SRAM CMOS
Supply Voltage (Core) 5 V —
MultiVolt I/O Support 3.3 V / 5 V —
Maximum Frequency 125 MHz —
Speed Grade -3 -3
Packhaging 100-pin TQFP (100-TQFP) —
Configuration Method SRAM, EPC1/EPC1064/EPC1213/EPC1441, microprocessor —
Operating Temperature (Commercial) 0 C to +70 C —
In-Circuit Reconfigurable Yes (ICR) —
Boundary Scan JTAG IEEE 1149.1 IEEE 1149.1 (JTAG)
Device Logic Elements / Cells — 208
Number of LABs/CLBs — 26
Number of Logic Elements / Cells — 208
Number of I/O — 78
Number of Gates — 2500
Voltage - Supply — 5 V
Temperature na Operasyon — -40C to +85C (industrial, I grade)
Uri ng Pagpapasok — Surface Mount
Packhaging / Kaso — 100-TQFP
Supplier Device Package — 100-TQFP
Maximum Toggle Frequency — 125 MHz
Architecture — SRAM-based, in-circuit reconfigurable (ICR)
Tindminan RoHS — [DATA_NEEDED: RoHS compliance status]

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