EPF8452ATC100-3N vs EPF8282ATC100-3 Comparison
Detailed side-by-side comparison of EPF8452ATC100-3N by Intel and EPF8282ATC100-3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EPF8452ATC100-3N | EPF8282ATC100-3 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Obsolete |
| Family | FLEX 8000 | FLEX 8000 |
| Logic Elements / Cells | 336 | — |
| Number of LABs/CLBs | 42 | — |
| Usable Gates | approximately 4,000 | 2,500 |
| User I/Os | 78 | — |
| Supply Voltage | 5 V (4.75 V to 5.25 V) | — |
| Process Technology | 0.42 µm CMOS SRAM | 0.42 micron CMOS SRAM |
| Operating Temperature | 0 °C to 70 °C (commercial) | — |
| Maximum Internal Frequency | 125 MHz | — |
| Package | 100-pin TQFP | 100-pin TQFP (100-TQFP) |
| Mounting Type | Surface Mount | — |
| Configuration Method | SRAM, in-circuit reconfigurable (EPC1/EPC1064/EPC1213/EPC1441 or parallel EPROM) | SRAM, EPC1/EPC1064/EPC1213/EPC1441, microprocessor |
| I/O Standard | 5 V CMOS, PCI-compliant drive | — |
| RoHS Status | [DATA_NEEDED: rohs status] | — |
| Logic Family | CMOS | — |
| Logic Cells (LEs) | — | 208 |
| Typical Gates Equivalent | — | 12,000 |
| Maximum User I/O | — | 78 |
| Number of Logic Array Blocks (LABs) | — | 26 |
| Embedded Array Blocks (EABs) | — | 6 |
| Total RAM Bits | — | 12 Kbits |
| Supply Voltage (Core) | — | 5 V |
| MultiVolt I/O Support | — | 3.3 V / 5 V |
| Maximum Frequency | — | 125 MHz |
| Speed Grade | — | -3 |
| Operating Temperature (Commercial) | — | 0 C to +70 C |
| In-Circuit Reconfigurable | — | Yes (ICR) |
| Boundary Scan | — | JTAG IEEE 1149.1 |