EPM2210GF324C5N vs EPM2210GF324I5N Comparison
Detailed side-by-side comparison of EPM2210GF324C5N by Intel and EPM2210GF324I5N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EPM2210GF324C5N | EPM2210GF324I5N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $17.90 | $42.00 |
| Family | MAX II G | β |
| Series | MAX II | β |
| Logic Elements | 2210 | 2210 |
| Equivalent Macrocells | 1700 | 1700 |
| User Flash Memory (UFM) | 8 Kbits | 8 Kbits |
| Maximum User I/O | 212 | β |
| Pin-to-Pin Delay (tPD) | 11.2 ns | β |
| Propagation Delay | 11.2 ns (max) | β |
| Technology | Flash CMOS, 6-layer metal | β |
| Core Voltage | 3.3 V / 2.5 V (internal) | β |
| I/O Standards | 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V (MultiVolt) | β |
| Package | 324-ball FineLine BGA (FBGA-324), 19 x 19 mm, 1.0 mm pitch | 324-ball FineLine BGA (FBGA-324), 19 x 19 mm, 1.0 mm pitch |
| Operating Temperature | 0 Β°C to +85 Β°C (commercial) | -40 Β°C to +100 Β°C (TJ) |
| Mounting Type | Surface Mount | Surface Mount |
| Programmability | In-system (JTAG / IEEE 1532), non-volatile | In-System Programmable (JTAG / ISP) |
| Lead Free | Yes | β |
| RoHS Status | Compliant | β |
| MSL Level | 3 | [DATA_NEEDED: MSL rating] |
| Device Family | β | MAX II |
| User I/O | β | 272 |
| Propagation Delay (tPD) | β | 7 ns |
| Core Voltage (VCCINT) | β | 1.8 V (typical) |
| I/O Voltage (VCCIO) | β | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) |
| Process Technology | β | 0.18 Β΅m 6-layer-metal flash |
| Lead Free / RoHS | β | Yes (RoHS compliant) |