EPM2210GF324C5N vs EPM2210GF324I5N Vergleich
Detaillierter Direktvergleich von EPM2210GF324C5N von Intel und EPM2210GF324I5N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EPM2210GF324C5N | EPM2210GF324I5N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $17,90 | $42,00 |
| Family | MAX II G | — |
| Series | MAX II | — |
| Logic Elements | 2210 | 2210 |
| Equivalent Macrocells | 1700 | 1700 |
| User Flash Memory (UFM) | 8 Kbits | 8 Kbits |
| Maximum User I/O | 212 | — |
| Pin-to-Pin Delay (tPD) | 11.2 ns | — |
| Propagation Delay | 11.2 ns (max) | — |
| Technology | Flash CMOS, 6-layer metal | — |
| Core Voltage | 3.3 V / 2.5 V (internal) | — |
| I/O Standards | 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V (MultiVolt) | — |
| Gehäuse | 324-ball FineLine BGA (FBGA-324), 19 x 19 mm, 1.0 mm pitch | 324-ball FineLine BGA (FBGA-324), 19 x 19 mm, 1.0 mm pitch |
| Betriebstemperatur | 0 °C to +85 °C (commercial) | -40 °C to +100 °C (TJ) |
| Montageart | Surface Mount | Surface Mount |
| Programmability | In-system (JTAG / IEEE 1532), non-volatile | In-System Programmable (JTAG / ISP) |
| Lead Free | Yes | — |
| RoHS-Status | Compliant | — |
| MSL-Level | 3 | [DATA_NEEDED: MSL rating] |
| Device Family | — | MAX II |
| User I/O | — | 272 |
| Propagation Delay (tPD) | — | 7 ns |
| Core Voltage (VCCINT) | — | 1.8 V (typical) |
| I/O Voltage (VCCIO) | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) |
| Process Technology | — | 0.18 µm 6-layer-metal flash |
| Lead Free / RoHS | — | Yes (RoHS compliant) |