EPM2210GF324C5N vs EPM2210GF324I5N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EPM2210GF324C5N disebabkan oleh Intel dan EPM2210GF324I5N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EPM2210GF324C5N | EPM2210GF324I5N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX II G | — |
| Series | MAX II | — |
| Logic Elements | 2210 | 2210 |
| Equivalent Macrocells | 1700 | 1700 |
| User Flash Memory (UFM) | 8 Kbits | 8 Kbits |
| Maximum User I/O | 212 | — |
| Pin-to-Pin Delay (tPD) | 11.2 ns | — |
| Propagation Delay | 11.2 ns (max) | — |
| Technology | Flash CMOS, 6-layer metal | — |
| Core Voltage | 3.3 V / 2.5 V (internal) | — |
| I/O Standards | 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V (MultiVolt) | — |
| Kemasan | 324-ball FineLine BGA (FBGA-324), 19 x 19 mm, 1.0 mm pitch | 324-ball FineLine BGA (FBGA-324), 19 x 19 mm, 1.0 mm pitch |
| Suhu Operasi | 0 °C to +85 °C (commercial) | -40 °C to +100 °C (TJ) |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Programmability | In-system (JTAG / IEEE 1532), non-volatile | In-System Programmable (JTAG / ISP) |
| Lead Free | Yes | — |
| Status RoHS | Compliant | — |
| Aras MSL | 3 | [DATA_NEEDED: MSL rating] |
| Device Family | — | MAX II |
| User I/O | — | 272 |
| Propagation Delay (tPD) | — | 7 ns |
| Core Voltage (VCCINT) | — | 1.8 V (typical) |
| I/O Voltage (VCCIO) | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) |
| Process Technology | — | 0.18 µm 6-layer-metal flash |
| Lead Free / RoHS | — | Yes (RoHS compliant) |