EPM2210GF324I5N vs EPM2210GF324C5N Comparison

Detailed side-by-side comparison of EPM2210GF324I5N by Intel and EPM2210GF324C5N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPM2210GF324I5N EPM2210GF324C5N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $42.00 $17.90
Device Family MAX II β€”
Logic Elements 2210 2210
Equivalent Macrocells 1700 1700
User I/O 272 β€”
Propagation Delay (tPD) 7 ns β€”
User Flash Memory (UFM) 8 Kbits 8 Kbits
Package 324-ball FineLine BGA (FBGA-324), 19 x 19 mm, 1.0 mm pitch 324-ball FineLine BGA (FBGA-324), 19 x 19 mm, 1.0 mm pitch
Mounting Type Surface Mount Surface Mount
Core Voltage (VCCINT) 1.8 V (typical) β€”
I/O Voltage (VCCIO) 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) β€”
Operating Temperature -40 Β°C to +100 Β°C (TJ) 0 Β°C to +85 Β°C (commercial)
Process Technology 0.18 Β΅m 6-layer-metal flash β€”
Programmability In-System Programmable (JTAG / ISP) In-system (JTAG / IEEE 1532), non-volatile
Lead Free / RoHS Yes (RoHS compliant) β€”
MSL Level [DATA_NEEDED: MSL rating] 3
Family β€” MAX II G
Series β€” MAX II
Maximum User I/O β€” 212
Pin-to-Pin Delay (tPD) β€” 11.2 ns
Propagation Delay β€” 11.2 ns (max)
Technology β€” Flash CMOS, 6-layer metal
Core Voltage β€” 3.3 V / 2.5 V (internal)
I/O Standards β€” 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V (MultiVolt)
Lead Free β€” Yes
RoHS Status β€” Compliant

Datasheets & Resources

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