EPM2210GF324I5N vs EPM2210GF324C5N Vergleich
Detaillierter Direktvergleich von EPM2210GF324I5N von Intel und EPM2210GF324C5N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EPM2210GF324I5N | EPM2210GF324C5N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $42,00 | $17,90 |
| Device Family | MAX II | — |
| Logic Elements | 2210 | 2210 |
| Equivalent Macrocells | 1700 | 1700 |
| User I/O | 272 | — |
| Propagation Delay (tPD) | 7 ns | — |
| User Flash Memory (UFM) | 8 Kbits | 8 Kbits |
| Gehäuse | 324-ball FineLine BGA (FBGA-324), 19 x 19 mm, 1.0 mm pitch | 324-ball FineLine BGA (FBGA-324), 19 x 19 mm, 1.0 mm pitch |
| Montageart | Surface Mount | Surface Mount |
| Core Voltage (VCCINT) | 1.8 V (typical) | — |
| I/O Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) | — |
| Betriebstemperatur | -40 °C to +100 °C (TJ) | 0 °C to +85 °C (commercial) |
| Process Technology | 0.18 µm 6-layer-metal flash | — |
| Programmability | In-System Programmable (JTAG / ISP) | In-system (JTAG / IEEE 1532), non-volatile |
| Lead Free / RoHS | Yes (RoHS compliant) | — |
| MSL-Level | [DATA_NEEDED: MSL rating] | 3 |
| Family | — | MAX II G |
| Series | — | MAX II |
| Maximum User I/O | — | 212 |
| Pin-to-Pin Delay (tPD) | — | 11.2 ns |
| Propagation Delay | — | 11.2 ns (max) |
| Technology | — | Flash CMOS, 6-layer metal |
| Core Voltage | — | 3.3 V / 2.5 V (internal) |
| I/O Standards | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V (MultiVolt) |
| Lead Free | — | Yes |
| RoHS-Status | — | Compliant |