EPM5032DI-20 - 32-Macrocell MAX 5000 EPLD, 62.5MHz, DIP-20 | Intel
MPN: EPM5032DI-20 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $15.2 | $152.00 |
| 100 | $12.4 | $1,240.00 |
| 500 | $10.1 | $5,050.00 |
| 1,000 | $8.75 | $8,750.00 |
Drop-in alternatives for EPM5032DI-20 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →EPM5032DI-20 Maximum Ratings & Electrical Characteristics
| Family | MAX 5000 (Altera legacy EPLD) |
| Architecture | CMOS PAL-type EPLD with PIA |
| Macrocells | 32 |
| Dedicated Inputs | 7 |
| Bidirectional I/O Pins | 16 |
| Product Terms | 320 (maximum) |
| Flip-Flops | 16 (one per macrocell) |
| Maximum Clock Frequency | 62.5 MHz |
| Pin-to-Pin Delay | 20 ns (speed grade -20) |
| Package | Ceramic DIP-20 (windowed, UV-erasable) |
| Operating Temperature | Industrial (per 'I' suffix) |
| Programming | UV-erasable CMOS, JEDEC fuse file |
| Development Tool | Altera MAX+PLUS II (legacy) |
EPM5032DI-20 Pin Configuration
| Pin 1 | I/O — Bidirectional I/O macrocell pin (group A) |
| Pin 2 | I/O — Bidirectional I/O macrocell pin (group A) |
| Pin 3 | I/O — Bidirectional I/O macrocell pin (group A) |
| Pin 4 | I/O — Bidirectional I/O macrocell pin (group A) |
| Pin 5 | I/O — Bidirectional I/O macrocell pin (group A) |
| Pin 6 | I/O — Bidirectional I/O macrocell pin (group A) |
| Pin 7 | I/O — Bidirectional I/O macrocell pin (group A) |
| Pin 8 | I/O — Bidirectional I/O macrocell pin (group A) |
| Pin 9 | INPUT — Dedicated input |
| Pin 10 | GND — Ground |
| Pin 11 | INPUT — Dedicated input |
| Pin 12 | INPUT — Dedicated input / global clock |
| Pin 13 | INPUT — Dedicated input / global OE |
| Pin 14 | INPUT — Dedicated input |
| Pin 15 | INPUT — Dedicated input |
| Pin 16 | INPUT — Dedicated input |
| Pin 17 | I/O — Bidirectional I/O macrocell pin (group B) |
| Pin 18 | I/O — Bidirectional I/O macrocell pin (group B) |
| Pin 19 | I/O — Bidirectional I/O macrocell pin (group B) |
| Pin 20 | VCC — Positive supply (5 V typical) |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM5032DI-20 is suitable for 6 applications: TTL/CMOS Glue-Logic Replacement, Address Decoding and Bus Interface, State-Machine Controllers, Legacy Industrial Control Boards, Peripheral Chip-Select Generator, Educational and Prototyping Platforms.
TTL/CMOS Glue-Logic Replacement
The EPM5032DI-20 replaces dozens of 7400-series SSI/MSI TTL gates with a single 32-macrocell EPLD, freeing board space and reducing power consumption in legacy industrial designs. With 320 product terms and 16 macrocell flip-flops, it can absorb an entire address-decoder, bus-arbitration, or state-machine cluster that previously required 10-20 discrete packages. The 62.5 MHz fMAX and 20 ns pin-to-pin delay match the timing of standard 74LS and 74F TTL, so signal integrity is preserved.
Recommended
Address Decoding and Bus Interface
The EPM5032DI-20's 32 macrocells and 320 product terms make it well-suited for address-decoding and bus-interface logic in 8-bit and 16-bit microprocessor systems. Each macrocell can implement a wide product-term sum (AND-OR), enabling complex address maps with chip-select outputs that previously required multiple 74LS138/139 decoders. The 7 dedicated inputs accept buffered address lines directly, while the 16 bidirectional I/O pins serve as peripheral chip-select outputs.
Recommended
State-Machine Controllers
State-machine controllers with up to 16 registered states fit naturally into the EPM5032DI-20's 16 macrocell flip-flops and PAL-type AND-OR architecture. The deterministic per-macrocell delay and wide product-term fan-in simplify timing closure versus discrete 74LS/74F flip-flop packages. Designers can implement Moore or Mealy machines with combinational output logic using the same macrocell flip-flops, achieving 62.5 MHz operation at the -20 speed grade.
Recommended
Legacy Industrial Control Boards
The EPM5032DI-20's ceramic DIP-20 industrial-temperature package and 20-year design heritage make it ideal for sustaining legacy industrial controllers that are still in service and where a board-level redesign is uneconomical. The windowed ceramic package supports UV erasure for field reprogramming during board rework, while the industrial temperature range tolerates factory-floor thermal cycling. Engineers maintaining 1990s-era PLCs, motor drives, and test fixtures rely on this exact part number.
Recommended
Peripheral Chip-Select Generator
The EPM5032DI-20 generates multiple peripheral chip-select signals from a single address bus, replacing a stack of 74LS138/139 decoders with one 32-macrocell EPLD. Each macrocell's wide product-term sum (up to 16 product terms) accommodates complex address maps, while the 62.5 MHz fMAX keeps chip-select timing aligned with the host microprocessor's bus cycle. The 16 I/O pins comfortably drive 8-12 peripheral enables with two pins reserved for handshaking.
Recommended
Educational and Prototyping Platforms
The EPM5032DI-20's UV-erasable windowed ceramic package and well-documented MAX+PLUS II toolchain make it a popular teaching aid in university digital-logic labs where students learn PAL-type architecture fundamentals. The 32-macrocell complexity is large enough to implement meaningful designs (UARTs, small CPUs, custom interfaces) yet small enough to fit a single lab session. Instructors value the predictable per-macrocell delay for teaching timing analysis.
Recommended
Recommended Products Summary
Engineering reference data for EPM5032DI-20 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM5032DC-20 | EPM5032DC-25 | EPM5032DC-15 | EPM5032DC20 | EPM5032DC |
|---|---|---|---|---|---|---|
| Package | Ceramic DIP-20 | Plastic DIP-20 - same footprint | Plastic DIP-20 - same footprint | Plastic DIP-20 - same footprint | Plastic DIP-20 - same footprint | Plastic DIP-20 - same footprint |
| Brand | Intel (legacy Altera) | Intel | Intel | Intel | Intel | Intel |
| Macrocells | 32 | 32 | 32 | 32 | 32 | 32 |
| Speed Grade (tPD) | 20 ns | 20 ns | 25 ns | 15 ns | 20 ns | [DATA_NEEDED] |
| Maximum Clock Frequency | 62.5 MHz | 62.5 MHz | 50 MHz (estimated from 25 ns tCO) | [DATA_NEEDED] | 62.5 MHz | [DATA_NEEDED] |
| Package Material | Ceramic (windowed) | Plastic (PDIP) | Plastic (PDIP) | Plastic (PDIP) | Plastic (PDIP) | Plastic (PDIP) |
| Temperature Range | Industrial | Commercial | Commercial | Commercial | Commercial | Commercial |
| UV Erasable | Yes (ceramic window) | No (OTP plastic) | No (OTP plastic) | No (OTP plastic) | No (OTP plastic) | No (OTP plastic) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- UV-erasable windowed ceramic package (vs EPM5032DC-20)
- Industrial temperature range (vs EPM5032DC-20)
- 20 ns speed grade (mid-range) (vs EPM5032DC-15)
Design Notes
The EPM5032DI-20 is a UV-erasable ceramic device, NOT one-time-programmable (OTP). If you cover the quartz window with opaque label, the part becomes difficult to reprogram; field engineers often forget this and lose the ability to update the JEDEC fuse file. For new designs where UV erasure is not required, prefer the plastic DIP-20 OTP variants (EPM5032DC-20 / EPM5032DC-25) for lower cost and easier handling.
Route all 7 dedicated inputs with short traces and place a 0.1 uF ceramic decoupling capacitor within 5 mm of the VCC pin (pin 20). The 16 bidirectional I/O pins each source/sink up to 8 mA (DC) per the MAX 5000 datasheet, so use wider traces (>= 0.3 mm) for any I/O pin driving LEDs or bus pull-ups. Add a bulk 10 uF tantalum capacitor on VCC for the simultaneous-switching current typical of PAL-type outputs.
The EPM5032DI-20 operates from a single 5 V supply and draws up to ~150 mA Icc when all 32 macrocells switch simultaneously at 62.5 MHz. Estimated: total dynamic power at 62.5 MHz with 50% toggle rate is roughly (150 mA x 5 V x 0.5) = 375 mW, dominated by the PIA charging/discharging. For battery-backed applications, gate the clock when the macrocells are idle to cut ICC by 80-90%.
Compliance Information
Ceramic DIP-20 EPLD predates RoHS directives and is typically supplied as a legacy Altera/Intel part with non-compliant lead finish. RoHS/REACH status not stated in available data; obsolete-status parts are commonly exempted under RoHS Annex IV. Use plastic-DIP variants for new RoHS-compliant designs.